? Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F10%3A00178862" target="_blank" >RIV/68407700:21110/10:00178862 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

? Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures

Popis výsledku v původním jazyce

The development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures is reported. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process to fabricate sensors with low motional resistance. The techniques suited for bondingthe MEMS sensors on a steel surface and a packaging technique for the bonded sensors are proposed for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with aresolution of 10 ?m and very low power consumption requirements is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in the tunnel test sections.

Název v anglickém jazyce

? Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures

Popis výsledku anglicky

The development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures is reported. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process to fabricate sensors with low motional resistance. The techniques suited for bondingthe MEMS sensors on a steel surface and a packaging technique for the bonded sensors are proposed for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with aresolution of 10 ?m and very low power consumption requirements is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in the tunnel test sections.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JM - Inženýrské stavitelství

OECD FORD obor

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Projekt

<a href="/cs/project/GA103%2F06%2F1257" target="_blank" >GA103/06/1257: Výzkum stárnutí podzemních konstrukcí s použitím monitorovacích a mikroměřících systémů</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2010

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Smart Structures and Systems

ISSN

1738-1584

e-ISSN

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Svazek periodika

2010 (6)

Číslo periodika v rámci svazku

3

Stát vydavatele periodika

KR - Korejská republika

Počet stran výsledku

14

Strana od-do

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Kód UT WoS článku

000276936700005

EID výsledku v databázi Scopus

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