Strain sensing on steel surfaces using vacuum packaged MEMS resonators

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F10%3A00190393" target="_blank" >RIV/68407700:21110/10:00190393 - isvavai.cz</a>

Výsledek na webu

<a href="http://elsevier.com/locate/procedia" target="_blank" >http://elsevier.com/locate/procedia</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.proeng.2010.09.383" target="_blank" >10.1016/j.proeng.2010.09.383</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Strain sensing on steel surfaces using vacuum packaged MEMS resonators

Popis výsledku v původním jazyce

The paper presents a technology for strain sensing on steel using resonant MEMS packaged in vacuum. For this purpose, a custom sensor fabrication technology and a novel vacuum packaging technique have been developed. The MEMS sensors have been fabricatedby surface micromachining of thick (15 um) Silicon On Insulator substrates with heavily doped handle layers (= 0.005 cm). Using this process, Double-Ended Tuning Fork (DETF) parallel-plate resonators with reduced coupling gaps (less than 1 um) have beenfabricated, using a high-performance Deep Reactive Ion Etching performed on submicrometric submicrometer features realized by near-UV lithography combined with a maskless line narrowing technique. The devices have been bonded to a thin steel bar by epoxy glue, packaged in vacuum and tested by applying strain to the bar, showing good tolerances to packaging parasitics, measurement reversibility, and strain sensitivity of 10 Hz/u?.

Název v anglickém jazyce

Strain sensing on steel surfaces using vacuum packaged MEMS resonators

Popis výsledku anglicky

The paper presents a technology for strain sensing on steel using resonant MEMS packaged in vacuum. For this purpose, a custom sensor fabrication technology and a novel vacuum packaging technique have been developed. The MEMS sensors have been fabricatedby surface micromachining of thick (15 um) Silicon On Insulator substrates with heavily doped handle layers (= 0.005 cm). Using this process, Double-Ended Tuning Fork (DETF) parallel-plate resonators with reduced coupling gaps (less than 1 um) have beenfabricated, using a high-performance Deep Reactive Ion Etching performed on submicrometric submicrometer features realized by near-UV lithography combined with a maskless line narrowing technique. The devices have been bonded to a thin steel bar by epoxy glue, packaged in vacuum and tested by applying strain to the bar, showing good tolerances to packaging parasitics, measurement reversibility, and strain sensitivity of 10 Hz/u?.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JM - Inženýrské stavitelství

OECD FORD obor

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Projekt

<a href="/cs/project/GA103%2F09%2F1600" target="_blank" >GA103/09/1600: Výzkum monitorovacích metod mikro-deformací ostění podzemních staveb (metra)</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2010

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Procedia Engineering

ISSN

1877-7058

e-ISSN

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Svazek periodika

5

Číslo periodika v rámci svazku

5

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

4

Strana od-do

1426-1429

Kód UT WoS článku

000287162400351

EID výsledku v databázi Scopus

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