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Influence of Stress Relief Annealing Parameters on Mechanical Properties and Decomposition of Eutectic Si Network of L-PBF Additive Manufactured Alloy AlSi10Mg

Identifikátory výsledku

  • Kód výsledku v IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F22%3A00359656" target="_blank" >RIV/68407700:21220/22:00359656 - isvavai.cz</a>

  • Výsledek na webu

    <a href="https://doi.org/10.3390/met12091497" target="_blank" >https://doi.org/10.3390/met12091497</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.3390/met12091497" target="_blank" >10.3390/met12091497</a>

Alternativní jazyky

  • Jazyk výsledku

    angličtina

  • Název v původním jazyce

    Influence of Stress Relief Annealing Parameters on Mechanical Properties and Decomposition of Eutectic Si Network of L-PBF Additive Manufactured Alloy AlSi10Mg

  • Popis výsledku v původním jazyce

    This paper evaluates the effect of stress-relieving heat treatment on the AlSi10Mg alloy prepared by additive manufacturing using the Laser Powder Bed Fusion (L-PBF) with print parameters: 370 W, 1400 m/s, and 50 μm. The as-built state and four different annealing modes (240 °C/2 h, 240 °C/6 h, 300 °C/2 h, and 300 °C/2 h/water-quenched) are investigated. To determine the effect of the annealing mode on the mechanical properties of the L-PBF AlSi10Mg alloy, heat-treated samples were compared with the as-built state and with each other. The mechanical properties of the samples were determined by tensile and hardness tests. The strength in the as-built state is 488 MPa, depending on the method of heat treatment, the strength values range from 296 MPa to 417 MPa, and the HV10 hardness values are in accordance with the measured strength values. Furthermore, the microstructure of the samples was investigated by scanning electron microscopy (SEM) analysis, which was then linked to the measured mechanical properties. The composition of the microstructure of the alloy and its influence on the mechanical properties were determined by energy dispersive spectroscopy (EDS) analysis. Furthermore, the differences between the individual heat treatments in comparison with the as-built state were analyzed and the phenomenon of decomposition of the silicon network after reaching specific temperatures was discussed and confirmed. The paper evaluates the effect of dwelling time on stress relief annealing. It was found that if annealing at intermediate temperatures of 240 and 300 °C is applied, changes in structure and mechanical properties are more temperature- than dwell-time-dependent.

  • Název v anglickém jazyce

    Influence of Stress Relief Annealing Parameters on Mechanical Properties and Decomposition of Eutectic Si Network of L-PBF Additive Manufactured Alloy AlSi10Mg

  • Popis výsledku anglicky

    This paper evaluates the effect of stress-relieving heat treatment on the AlSi10Mg alloy prepared by additive manufacturing using the Laser Powder Bed Fusion (L-PBF) with print parameters: 370 W, 1400 m/s, and 50 μm. The as-built state and four different annealing modes (240 °C/2 h, 240 °C/6 h, 300 °C/2 h, and 300 °C/2 h/water-quenched) are investigated. To determine the effect of the annealing mode on the mechanical properties of the L-PBF AlSi10Mg alloy, heat-treated samples were compared with the as-built state and with each other. The mechanical properties of the samples were determined by tensile and hardness tests. The strength in the as-built state is 488 MPa, depending on the method of heat treatment, the strength values range from 296 MPa to 417 MPa, and the HV10 hardness values are in accordance with the measured strength values. Furthermore, the microstructure of the samples was investigated by scanning electron microscopy (SEM) analysis, which was then linked to the measured mechanical properties. The composition of the microstructure of the alloy and its influence on the mechanical properties were determined by energy dispersive spectroscopy (EDS) analysis. Furthermore, the differences between the individual heat treatments in comparison with the as-built state were analyzed and the phenomenon of decomposition of the silicon network after reaching specific temperatures was discussed and confirmed. The paper evaluates the effect of dwelling time on stress relief annealing. It was found that if annealing at intermediate temperatures of 240 and 300 °C is applied, changes in structure and mechanical properties are more temperature- than dwell-time-dependent.

Klasifikace

  • Druh

    J<sub>imp</sub> - Článek v periodiku v databázi Web of Science

  • CEP obor

  • OECD FORD obor

    20501 - Materials engineering

Návaznosti výsledku

  • Projekt

    <a href="/cs/project/EF16_019%2F0000826" target="_blank" >EF16_019/0000826: Centrum pokročilých leteckých technologií</a><br>

  • Návaznosti

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Ostatní

  • Rok uplatnění

    2022

  • Kód důvěrnosti údajů

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Údaje specifické pro druh výsledku

  • Název periodika

    Metals — Open Access Metallurgy Journal

  • ISSN

    2075-4701

  • e-ISSN

    2075-4701

  • Svazek periodika

    12

  • Číslo periodika v rámci svazku

    9

  • Stát vydavatele periodika

    CH - Švýcarská konfederace

  • Počet stran výsledku

    14

  • Strana od-do

    1-14

  • Kód UT WoS článku

    000856654900001

  • EID výsledku v databázi Scopus

    2-s2.0-85138698518