Effect of Positive Voltage Pulses in HiPIMS on the Ti-PEEK Interface Formation

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F24%3A00375680" target="_blank" >RIV/68407700:21220/24:00375680 - isvavai.cz</a>

Výsledek na webu

<a href="https://setcor.org/userfiles/files/2024/Vienna/SICT-PlasmaTech-Tribology-2024-Joint-Conferences-Book-of-Abstracts.pdf" target="_blank" >https://setcor.org/userfiles/files/2024/Vienna/SICT-PlasmaTech-Tribology-2024-Joint-Conferences-Book-of-Abstracts.pdf</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Effect of Positive Voltage Pulses in HiPIMS on the Ti-PEEK Interface Formation

Popis výsledku v původním jazyce

The application of metal coatings on polymers is limited in many technologies due to the electrical non-conductivity of the polymers. In the case of magnetron sputtering, it is not possible to simply apply a negative bias to the non-conductive material to enhance the ion bombardment, which can affect the formation of the coating-substrate interface and subsequent coating growth. The new perspective method for coating non-conductive materials is HiPIMS (high-power impulse magnetron sputtering) (Figure 1) with a positive pulse [1]. This method was introduced relatively recently, but the effect of a positive pulse has been known for some time in pulsed direct current (DC) magnetron sputtering [2]. The standard HiPIMS method is based on the application of high power in short (tens µs) negative voltage pulses on magnetron cathodes. For the HiPIMS method with a positive pulse, a negative pulse is followed by a positive pulse that repels and accelerates positive ions from the space in front of the target toward the surface of the growing coating. Then, the ions can be accelerated to polymer materials including both non-conductive and conductive polymers. The coating may, for example, reduce the abrasion of the polymer surface, be used as an electrode on conductive polymers, or change the surface properties of polymer implants. In all of these cases, the surface treatment is ensured by applying a metal coating, which must have a very good adhesion. The aim of the work was to verify the influence of positive pulses on the formation of the adhesion interface between the Ti coating and the polyetheretherketone (PEEK). PEEK is electrically non-conductive, but if it contains carbon fibres (CF-PEEK) or carbon nanotubes (CNT-PEEK), its resistivity approaches the level of conductive materials and the effect of negative bias can be tested on it. Therefore, two variants of PEEK were chosen for the test, a non-conductive one in the basic state and a conductive one filled with carbon nanotubes. The performed analyses were focused on the evaluation of the depth of the implanted Ti ions and, at the same time, on the chemical composition of the Ti coating. The application of a positive pulse on the non-conductive PEEK had the same effect on the depth of the Ti ion implantation as the DC negative bias on the conductive PEEK. The depth of Ti implanted analysed by the XPS method did not exceed 60 nm for any of the variants used. However, a positive pulse had a clear effect on the formation of a chemically pure interface without the formation of an atomic inter-mixed layer.

Název v anglickém jazyce

Effect of Positive Voltage Pulses in HiPIMS on the Ti-PEEK Interface Formation

Popis výsledku anglicky

The application of metal coatings on polymers is limited in many technologies due to the electrical non-conductivity of the polymers. In the case of magnetron sputtering, it is not possible to simply apply a negative bias to the non-conductive material to enhance the ion bombardment, which can affect the formation of the coating-substrate interface and subsequent coating growth. The new perspective method for coating non-conductive materials is HiPIMS (high-power impulse magnetron sputtering) (Figure 1) with a positive pulse [1]. This method was introduced relatively recently, but the effect of a positive pulse has been known for some time in pulsed direct current (DC) magnetron sputtering [2]. The standard HiPIMS method is based on the application of high power in short (tens µs) negative voltage pulses on magnetron cathodes. For the HiPIMS method with a positive pulse, a negative pulse is followed by a positive pulse that repels and accelerates positive ions from the space in front of the target toward the surface of the growing coating. Then, the ions can be accelerated to polymer materials including both non-conductive and conductive polymers. The coating may, for example, reduce the abrasion of the polymer surface, be used as an electrode on conductive polymers, or change the surface properties of polymer implants. In all of these cases, the surface treatment is ensured by applying a metal coating, which must have a very good adhesion. The aim of the work was to verify the influence of positive pulses on the formation of the adhesion interface between the Ti coating and the polyetheretherketone (PEEK). PEEK is electrically non-conductive, but if it contains carbon fibres (CF-PEEK) or carbon nanotubes (CNT-PEEK), its resistivity approaches the level of conductive materials and the effect of negative bias can be tested on it. Therefore, two variants of PEEK were chosen for the test, a non-conductive one in the basic state and a conductive one filled with carbon nanotubes. The performed analyses were focused on the evaluation of the depth of the implanted Ti ions and, at the same time, on the chemical composition of the Ti coating. The application of a positive pulse on the non-conductive PEEK had the same effect on the depth of the Ti ion implantation as the DC negative bias on the conductive PEEK. The depth of Ti implanted analysed by the XPS method did not exceed 60 nm for any of the variants used. However, a positive pulse had a clear effect on the formation of a chemically pure interface without the formation of an atomic inter-mixed layer.

Druh

O - Ostatní výsledky

CEP obor

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OECD FORD obor

20506 - Coating and films

Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů