Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00210116" target="_blank" >RIV/68407700:21230/13:00210116 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1016/j.surfcoat.2013.06.040" target="_blank" >http://dx.doi.org/10.1016/j.surfcoat.2013.06.040</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.surfcoat.2013.06.040" target="_blank" >10.1016/j.surfcoat.2013.06.040</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Popis výsledku v původním jazyce

The microstructure of sputter deposited Ti-rich Ni-Ti thin films doped with Cu in the range 0?20.4 at.% and annealed for 1 h at 500 and 600 °C has been investigated and correlated with the mechanical properties of the films measured by depth-sensing nanoindentation. X-ray diffraction analysis showed the microstructural evolution of Ni-Ti thin films when doped with Cu and annealed at different temperatures. Heat treatments promoted the nucleation and growth of Ti2Ni precipitates in Ti-rich Ni-Ti thin films, which affected the stability of austenitic and martensitic phases at ambient temperature. Doping with Cu caused the formation of Ti(Ni, Cu)2 plate precipitates, which became more finely and densely dispersed in the grains with increasing Cu content.TEM analysis showed a columnar grain morphology extended through the whole films thickness, while with increasing Cu content a noticeable lateral grain refinement was induced by segregation of a (Ni, Cu)-rich phase to grain boundaries. Th

Název v anglickém jazyce

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Popis výsledku anglicky

The microstructure of sputter deposited Ti-rich Ni-Ti thin films doped with Cu in the range 0?20.4 at.% and annealed for 1 h at 500 and 600 °C has been investigated and correlated with the mechanical properties of the films measured by depth-sensing nanoindentation. X-ray diffraction analysis showed the microstructural evolution of Ni-Ti thin films when doped with Cu and annealed at different temperatures. Heat treatments promoted the nucleation and growth of Ti2Ni precipitates in Ti-rich Ni-Ti thin films, which affected the stability of austenitic and martensitic phases at ambient temperature. Doping with Cu caused the formation of Ti(Ni, Cu)2 plate precipitates, which became more finely and densely dispersed in the grains with increasing Cu content.TEM analysis showed a columnar grain morphology extended through the whole films thickness, while with increasing Cu content a noticeable lateral grain refinement was induced by segregation of a (Ni, Cu)-rich phase to grain boundaries. Th

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JI - Kompositní materiály

OECD FORD obor

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Projekt

—

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Surface and Coatings Technology

ISSN

0257-8972

e-ISSN

—

Svazek periodika

237

Číslo periodika v rámci svazku

December

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

8

Strana od-do

261-268

Kód UT WoS článku

000330488000037

EID výsledku v databázi Scopus

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