Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00219138" target="_blank" >RIV/68407700:21230/14:00219138 - isvavai.cz</a>

Výsledek na webu

<a href="http://link.springer.com/article/10.1007/s13369-014-1167-7" target="_blank" >http://link.springer.com/article/10.1007/s13369-014-1167-7</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s13369-014-1167-7" target="_blank" >10.1007/s13369-014-1167-7</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach

Popis výsledku v původním jazyce

This paper examines the effects of the time and temperature of the curing process and the effect of the pad surface material on the electrical resistance of joints formed using electrically conductive adhesives (ECA). Two types of isotropic ECA, composedof a bis-phenol epoxy matrix filled with silver flakes, were tested. The experimental data were processed in two ways, by performing full factorial experiments (FFE) of the 23 type and by using an L4 type Taguchi orthogonal array, and the results were then compared. It was found that the joint resistance is mainly affected by the curing temperature, and is less dependent on the curing time and the surface material. The interactions between these factors have been analyzed through FFE. The results showed that the Taguchi method is quite precise for the main factors, but is insufficiently accurate for processes with significant numbers of interactions.

Název v anglickém jazyce

Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach

Popis výsledku anglicky

This paper examines the effects of the time and temperature of the curing process and the effect of the pad surface material on the electrical resistance of joints formed using electrically conductive adhesives (ECA). Two types of isotropic ECA, composedof a bis-phenol epoxy matrix filled with silver flakes, were tested. The experimental data were processed in two ways, by performing full factorial experiments (FFE) of the 23 type and by using an L4 type Taguchi orthogonal array, and the results were then compared. It was found that the joint resistance is mainly affected by the curing temperature, and is less dependent on the curing time and the surface material. The interactions between these factors have been analyzed through FFE. The results showed that the Taguchi method is quite precise for the main factors, but is insufficiently accurate for processes with significant numbers of interactions.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2014

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Arabian Journal for Science and Engineering

ISSN

1319-8025

e-ISSN

—

Svazek periodika

39

Číslo periodika v rámci svazku

39

Stát vydavatele periodika

DE - Spolková republika Německo

Počet stran výsledku

10

Strana od-do

4935-4944

Kód UT WoS článku

000338199100049

EID výsledku v databázi Scopus

2-s2.0-84902668490