Whiskers Growth on Thick Tin Layers and Various Types of Surfaces

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00221826" target="_blank" >RIV/68407700:21230/14:00221826 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887591&isnumber=6887550" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887591&isnumber=6887550</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2014.6887591" target="_blank" >10.1109/ISSE.2014.6887591</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Whiskers Growth on Thick Tin Layers and Various Types of Surfaces

Popis výsledku v původním jazyce

The transition from a highly widespread lead solders to lead-free solder alloy types meant many changes in the electrical industry. This transition has brought many technological phenomena that deserve our attention and they have to be still addressed inorder to improve the quality and reliability of manufacturing printed circuit boards. One of them is the presence of small crystalline formations on the surfaces of tin and some tin alloys which are called whiskers. This article focuses on the influenceof the used electrical materials and their surface treatments on the growth of tin whiskers. For our experiment were selected two lead-free solders with a high percentage representation of tin, by which are Sn95,5Ag3,8Cu0,7 (SAC 387) and Sn99Cu1. Solders were plated in a thick layer on the three types of metal substrates with various surface finishes. For this experiment was chosen copper, brass and phosphor bronze. The created samples were exposed to static mechanical stresses of compr

Název v anglickém jazyce

Whiskers Growth on Thick Tin Layers and Various Types of Surfaces

Popis výsledku anglicky

The transition from a highly widespread lead solders to lead-free solder alloy types meant many changes in the electrical industry. This transition has brought many technological phenomena that deserve our attention and they have to be still addressed inorder to improve the quality and reliability of manufacturing printed circuit boards. One of them is the presence of small crystalline formations on the surfaces of tin and some tin alloys which are called whiskers. This article focuses on the influenceof the used electrical materials and their surface treatments on the growth of tin whiskers. For our experiment were selected two lead-free solders with a high percentage representation of tin, by which are Sn95,5Ag3,8Cu0,7 (SAC 387) and Sn99Cu1. Solders were plated in a thick layer on the three types of metal substrates with various surface finishes. For this experiment was chosen copper, brass and phosphor bronze. The created samples were exposed to static mechanical stresses of compr

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2014

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

37th Int. Spring Seminar on Electronics Technology

ISBN

978-1-4799-4455-2

ISSN

—

e-ISSN

—

Počet stran výsledku

5

Strana od-do

193-197

Název nakladatele

IEEE

Místo vydání

New York

Místo konání akce

Drážďany

Datum konání akce

7. 5. 2014

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000346580500039