Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00349981" target="_blank" >RIV/68407700:21230/21:00349981 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE51996.2021.9467629" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467629</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467629" target="_blank" >10.1109/ISSE51996.2021.9467629</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces

Popis výsledku v původním jazyce

One of the hardly predictable issuesin the case of solder joints are tin whiskers. Tin whiskers are electrically conductive crystals that spontaneously grow on a surface.This article deals with tin whiskers growth on the three types of metallization (pure tin, SnCu1 and SnCu3 solder alloy) of the copper substrate. Two stressing factors were considered in the experiment –temperature ageing (three temperature conditions were chosen: 20 °C, 50 °C and 80 °C) and mechanical stress via bend of wire before and after the soldering process. The incidence ofwhiskers on the surfaces was observed by confocal microscopy. The results show that the major influence on whiskers incidence has two factors, mechanical stress followed by the influence of temperature. Whereas the other factor –copper content in used materials showed a minor influence on whiskers incidence.

Název v anglickém jazyce

Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces

Popis výsledku anglicky

One of the hardly predictable issuesin the case of solder joints are tin whiskers. Tin whiskers are electrically conductive crystals that spontaneously grow on a surface.This article deals with tin whiskers growth on the three types of metallization (pure tin, SnCu1 and SnCu3 solder alloy) of the copper substrate. Two stressing factors were considered in the experiment –temperature ageing (three temperature conditions were chosen: 20 °C, 50 °C and 80 °C) and mechanical stress via bend of wire before and after the soldering process. The incidence ofwhiskers on the surfaces was observed by confocal microscopy. The results show that the major influence on whiskers incidence has two factors, mechanical stress followed by the influence of temperature. Whereas the other factor –copper content in used materials showed a minor influence on whiskers incidence.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-6654-1477-7

ISSN

—

e-ISSN

2161-2528

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Bautzen

Datum konání akce

5. 5. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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