Whisker growth and its dependence on substrate type and applied stress

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00303329" target="_blank" >RIV/68407700:21230/16:00303329 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563202" target="_blank" >http://dx.doi.org/10.1109/ISSE.2016.7563202</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563202" target="_blank" >10.1109/ISSE.2016.7563202</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Whisker growth and its dependence on substrate type and applied stress

Popis výsledku v původním jazyce

This article deals with influence of long term mechanical and temperature stress on whisker growth. The experiments were conducted on three different surfaces. FR4 substrate was having copper, gold and HAL surface finish. Copper and gold surface finish was provided with thin layer of solder. Altogether, three solders (Sn63%Pb37%, Sn99%Cu1% and Sn97%Cu3%) were used. The samples were exposed to long term stress. The aging lasted 6500 hours and the temperature was either laboratory for the first batch or elevated (50 °C) for the second batch. The whisker growth was not observed on samples where the solder alloy was deposited in a thick layer, not even after exposure to elevated temperature or bolt induced compressive stress. The highest amount of tin whiskers was observed on a sample with copper surface finish and solder with high tin content, specifically Sn99%Cu1% solder. The presence of lead in the solder hindered the whisker growth. The length of the whiskers varied from tens to hundreds of micrometers. The whisker observation and measurement was conducted using Olympus SZX8 microscope.

Název v anglickém jazyce

Whisker growth and its dependence on substrate type and applied stress

Popis výsledku anglicky

This article deals with influence of long term mechanical and temperature stress on whisker growth. The experiments were conducted on three different surfaces. FR4 substrate was having copper, gold and HAL surface finish. Copper and gold surface finish was provided with thin layer of solder. Altogether, three solders (Sn63%Pb37%, Sn99%Cu1% and Sn97%Cu3%) were used. The samples were exposed to long term stress. The aging lasted 6500 hours and the temperature was either laboratory for the first batch or elevated (50 °C) for the second batch. The whisker growth was not observed on samples where the solder alloy was deposited in a thick layer, not even after exposure to elevated temperature or bolt induced compressive stress. The highest amount of tin whiskers was observed on a sample with copper surface finish and solder with high tin content, specifically Sn99%Cu1% solder. The presence of lead in the solder hindered the whisker growth. The length of the whiskers varied from tens to hundreds of micrometers. The whisker observation and measurement was conducted using Olympus SZX8 microscope.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

978-1-5090-1389-0

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

4

Strana od-do

263-266

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Plzeň

Datum konání akce

18. 5. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000387089800053