Quantitative Characteristics of Inhomogeneous Microstructure in UFG Copper
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00222644" target="_blank" >RIV/68407700:21230/14:00222644 - isvavai.cz</a>
Nalezeny alternativní kódy
RIV/68081723:_____/14:00435653 RIV/70883521:28610/14:43873145
Výsledek na webu
<a href="http://dx.doi.org/10.1088/1757-899X/63/1/012137" target="_blank" >http://dx.doi.org/10.1088/1757-899X/63/1/012137</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1088/1757-899X/63/1/012137" target="_blank" >10.1088/1757-899X/63/1/012137</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Quantitative Characteristics of Inhomogeneous Microstructure in UFG Copper
Popis výsledku v původním jazyce
The ultrafine-grained microstructure of pure copper processed by equal-channel angular pressing and its temperature-induced changes were evaluated in order to characterize heterogeneous distribution of fine- and larger-sized grains in the microstructure.ECAP was conducted at room temperature with a die that had an internal angle of 90° between the two parts of the channel. The subsequent extrusion passes were performed by route B C up to 8 ECAP passes and tested under constant load. Creep test was performed on the samples processed by 8 ECAP passes in tension at 373 K under an applied stress 260 MPa. The analyses of microstructure were performed by 3 dimensional electron-back scatter diffraction (3D EBSD) technique. The volume characteristics of microstructure and its inhomogeneity were evaluated and the relationships microstructure/creep behaviour of UFG copper was discussed.
Název v anglickém jazyce
Quantitative Characteristics of Inhomogeneous Microstructure in UFG Copper
Popis výsledku anglicky
The ultrafine-grained microstructure of pure copper processed by equal-channel angular pressing and its temperature-induced changes were evaluated in order to characterize heterogeneous distribution of fine- and larger-sized grains in the microstructure.ECAP was conducted at room temperature with a die that had an internal angle of 90° between the two parts of the channel. The subsequent extrusion passes were performed by route B C up to 8 ECAP passes and tested under constant load. Creep test was performed on the samples processed by 8 ECAP passes in tension at 373 K under an applied stress 260 MPa. The analyses of microstructure were performed by 3 dimensional electron-back scatter diffraction (3D EBSD) technique. The volume characteristics of microstructure and its inhomogeneity were evaluated and the relationships microstructure/creep behaviour of UFG copper was discussed.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
BA - Obecná matematika
OECD FORD obor
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Návaznosti výsledku
Projekt
<a href="/cs/project/ED1.1.00%2F02.0068" target="_blank" >ED1.1.00/02.0068: CEITEC - central european institute of technology</a><br>
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2014
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
IOP Conf. Series: Materials Science and Engineering
ISBN
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ISSN
1757-8981
e-ISSN
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Počet stran výsledku
6
Strana od-do
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Název nakladatele
IOP Publishing
Místo vydání
London
Místo konání akce
Metz
Datum konání akce
30. 6. 2014
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
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