Temperature distribution during the phase change in the volume of the solder alloy

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Temperature distribution during the phase change in the volume of the solder alloy

Popis výsledku v původním jazyce

Solder is usually an alloy of two and more metals. Very often is used tin, lead, copper, silver, bismuth, nickel, etc. for its production. If the alloy is exposed to a sufficiently high temperature, it is induced phase change from solid to liquid phase for it. Phase is changed again from liquid to solid during cooling substance. At this point, the substance generates a latent heat that is manifests differently for each alloy. Each component contributes its thermal and conductivity parameters into the overall properties of the alloy. The result determines quantity of the generated latent heat. And by final amount of the temperature acts on their surroundings. There have been several experimental measurements for determining of decomposition of temperature in a volume of electrically conductive solder joints during a phase change (from liquid to solidstate). Measurements were carried out on the reference alloy Sn-Pb (eutectic) and three lead-free solder alloys.

Název v anglickém jazyce

Temperature distribution during the phase change in the volume of the solder alloy

Popis výsledku anglicky

Solder is usually an alloy of two and more metals. Very often is used tin, lead, copper, silver, bismuth, nickel, etc. for its production. If the alloy is exposed to a sufficiently high temperature, it is induced phase change from solid to liquid phase for it. Phase is changed again from liquid to solid during cooling substance. At this point, the substance generates a latent heat that is manifests differently for each alloy. Each component contributes its thermal and conductivity parameters into the overall properties of the alloy. The result determines quantity of the generated latent heat. And by final amount of the temperature acts on their surroundings. There have been several experimental measurements for determining of decomposition of temperature in a volume of electrically conductive solder joints during a phase change (from liquid to solidstate). Measurements were carried out on the reference alloy Sn-Pb (eutectic) and three lead-free solder alloys.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

978-1-5090-1389-0

ISSN

2161-2536

e-ISSN

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Počet stran výsledku

4

Strana od-do

222-225

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Plzeň

Datum konání akce

18. 5. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000387089800044