Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00306429" target="_blank" >RIV/68407700:21230/17:00306429 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-11-2016-0029" target="_blank" >http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-11-2016-0029</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/SSMT-11-2016-0029" target="_blank" >10.1108/SSMT-11-2016-0029</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Popis výsledku v původním jazyce

Leider was the first to summarize the knowledge on VPS in recent years (Leider, 2002), covering the basic formulation of heat transfer during the process, which was based on the Nusselt theory of filmwise condensation. Leider also investigated different condensation media types, and the dependency of the PCB alignment, from the aspect of vertical and horizontal positioning in the work zone. It was clearly indicated that, with a vertical alignment, the heat transfer coefficient may rise by 25 to 50% depending on the condensation medium. More recently, it was found by Illés that the inclination of the board had a serious effect on the heating, and the heat distribution (Illés, 2016.); the results were obtained from verified modelling software. No actual practical investigation was published about the exact effect of inclination during VP soldering, so a deeper investigation was needed with novel measurement approaches.

Název v anglickém jazyce

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Popis výsledku anglicky

Leider was the first to summarize the knowledge on VPS in recent years (Leider, 2002), covering the basic formulation of heat transfer during the process, which was based on the Nusselt theory of filmwise condensation. Leider also investigated different condensation media types, and the dependency of the PCB alignment, from the aspect of vertical and horizontal positioning in the work zone. It was clearly indicated that, with a vertical alignment, the heat transfer coefficient may rise by 25 to 50% depending on the condensation medium. More recently, it was found by Illés that the inclination of the board had a serious effect on the heating, and the heat distribution (Illés, 2016.); the results were obtained from verified modelling software. No actual practical investigation was published about the exact effect of inclination during VP soldering, so a deeper investigation was needed with novel measurement approaches.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Soldering & Surface Mount Technology

ISSN

0954-0911

e-ISSN

1758-6836

Svazek periodika

29

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

8

Strana od-do

34-41

Kód UT WoS článku

000396464600007

EID výsledku v databázi Scopus

2-s2.0-85011015050