Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00341387" target="_blank" >RIV/68407700:21230/20:00341387 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1108/SSMT-11-2019-0038" target="_blank" >https://doi.org/10.1108/SSMT-11-2019-0038</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/SSMT-11-2019-0038" target="_blank" >10.1108/SSMT-11-2019-0038</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces

Popis výsledku v původním jazyce

Purpose: The paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed Circuit Board (PCB) surfaces. The investigation can help develop a better understanding of the process and provide information for future modelling of the process. Design/methodology/approach: For the investigations, flame retardant grade 4 (FR4) PCB plates and sealed plate–based boxes were immersed into saturated vapour of an experimental oven. The temperature and resulting heat transfer coefficients were analysed according to the sample boxes and the surface orientations. In addition, the boxes’ vapour consumption was investigated with pressure measurements. Findings: The horizontal top- and bottom-side heating shows very similar results. In addition, the sides of a box were heated in a manner similar to the top and the bottom sides, but there was a slight increase in the heat transfer coefficient because of the vertical wall alignment. The pressure measurements reveal the dynamic changes in vapour after immersion of the boxes. Practical implications: The findings may help to show differences on different surface orientations, pointing to more precise, explicit and multiphysics simulation results. Originality/value: The experiments present an aspect of heat transfer coefficient differences in VPS ovens, also highlighting the effect of initial pressure drop inside the workspace of an oven.

Název v anglickém jazyce

Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces

Popis výsledku anglicky

Purpose: The paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed Circuit Board (PCB) surfaces. The investigation can help develop a better understanding of the process and provide information for future modelling of the process. Design/methodology/approach: For the investigations, flame retardant grade 4 (FR4) PCB plates and sealed plate–based boxes were immersed into saturated vapour of an experimental oven. The temperature and resulting heat transfer coefficients were analysed according to the sample boxes and the surface orientations. In addition, the boxes’ vapour consumption was investigated with pressure measurements. Findings: The horizontal top- and bottom-side heating shows very similar results. In addition, the sides of a box were heated in a manner similar to the top and the bottom sides, but there was a slight increase in the heat transfer coefficient because of the vertical wall alignment. The pressure measurements reveal the dynamic changes in vapour after immersion of the boxes. Practical implications: The findings may help to show differences on different surface orientations, pointing to more precise, explicit and multiphysics simulation results. Originality/value: The experiments present an aspect of heat transfer coefficient differences in VPS ovens, also highlighting the effect of initial pressure drop inside the workspace of an oven.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

10302 - Condensed matter physics (including formerly solid state physics, supercond.)

Projekt

—

Návaznosti

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Soldering & Surface Mount Technology

ISSN

0954-0911

e-ISSN

1758-6836

Svazek periodika

32

Číslo periodika v rámci svazku

4

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

6

Strana od-do

247-252

Kód UT WoS článku

000524479600001

EID výsledku v databázi Scopus

2-s2.0-85083058647