Identification and caracterization of ß->α-Sn transition with electrical resistance measurements in SnCu1 bulk alloy inoculated with InSb
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00320500" target="_blank" >RIV/68407700:21230/17:00320500 - isvavai.cz</a>
Výsledek na webu
<a href="https://link.springer.com/article/10.1007%2Fs10854-017-7539-5#aboutcontent" target="_blank" >https://link.springer.com/article/10.1007%2Fs10854-017-7539-5#aboutcontent</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1007/s10854-017-7539-5" target="_blank" >10.1007/s10854-017-7539-5</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Identification and caracterization of ß->α-Sn transition with electrical resistance measurements in SnCu1 bulk alloy inoculated with InSb
Popis výsledku v původním jazyce
In this paper, the allotropic transition of ß to α-Sn (so called “tin pest”) was identified with electrical resistance measurements. Samples were prepared from SnCu1 alloy using mechanical treatment of two different sample sizes, artificially inoculated with InSb and stored at -18°C for 9 weeks. The electrical resistance measurement showed that in the case of SnCu1 solder alloy the α-Sn transition has three stages: nucleation, growth and the saturation phase, when the transition is almost stopped. It was proven by focused ion beam cross-sectioning and Mösbauer spectroscopy that the developed α-Sn phase can enclose the metastable non-transitioned ß-Sn preventing its further transition and resulting the saturation phase of the phenomenon. In addition, the results point out that the rate of vertical expansion of the α-Sn into the sample body can be equivalent or higher than the horizontal expansion.
Název v anglickém jazyce
Identification and caracterization of ß->α-Sn transition with electrical resistance measurements in SnCu1 bulk alloy inoculated with InSb
Popis výsledku anglicky
In this paper, the allotropic transition of ß to α-Sn (so called “tin pest”) was identified with electrical resistance measurements. Samples were prepared from SnCu1 alloy using mechanical treatment of two different sample sizes, artificially inoculated with InSb and stored at -18°C for 9 weeks. The electrical resistance measurement showed that in the case of SnCu1 solder alloy the α-Sn transition has three stages: nucleation, growth and the saturation phase, when the transition is almost stopped. It was proven by focused ion beam cross-sectioning and Mösbauer spectroscopy that the developed α-Sn phase can enclose the metastable non-transitioned ß-Sn preventing its further transition and resulting the saturation phase of the phenomenon. In addition, the results point out that the rate of vertical expansion of the α-Sn into the sample body can be equivalent or higher than the horizontal expansion.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
10301 - Atomic, molecular and chemical physics (physics of atoms and molecules including collision, interaction with radiation, magnetic resonances, Mössbauer effect)
Návaznosti výsledku
Projekt
—
Návaznosti
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Ostatní
Rok uplatnění
2017
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Journal of materials science - materials in electronics
ISSN
0957-4522
e-ISSN
1573-482X
Svazek periodika
28
Číslo periodika v rámci svazku
21
Stát vydavatele periodika
US - Spojené státy americké
Počet stran výsledku
7
Strana od-do
16329-16335
Kód UT WoS článku
000413232000072
EID výsledku v databázi Scopus
2-s2.0-85023766091