Effect of Recrystallization on beta to alpha-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00344842" target="_blank" >RIV/68407700:21230/20:00344842 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.3390/ma13040968" target="_blank" >https://doi.org/10.3390/ma13040968</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma13040968" target="_blank" >10.3390/ma13040968</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of Recrystallization on beta to alpha-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb

Popis výsledku v původním jazyce

The effect of recrystallization of 99.3Sn-0.7Cu wt. % solder alloy on the allotropic transition of beta to alpha-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples were used as the reference material and the other half were annealed at 180 degrees C for 72 h, which caused the recrystallization of the alloy. The samples were stored at -10 and -20 degrees C. The beta-Sn to alpha-Sn transition was monitored using electrical resistance measurements. The expansion and separation of the tin grains during the beta-Sn to alpha-Sn transition process were studied using scanning electron microscopy. The recrystallization of the alloy suppressed the tin pest phenomenon considerably since it decreased the number of defects in the crystal structure where heterogeneous nucleation of beta-Sn to alpha-Sn transition could occur. In the case of InSb inoculation, the spreading of the transition towards the bulk was as fast as the spreading parallel to the surface of the sample.

Název v anglickém jazyce

Effect of Recrystallization on beta to alpha-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb

Popis výsledku anglicky

The effect of recrystallization of 99.3Sn-0.7Cu wt. % solder alloy on the allotropic transition of beta to alpha-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples were used as the reference material and the other half were annealed at 180 degrees C for 72 h, which caused the recrystallization of the alloy. The samples were stored at -10 and -20 degrees C. The beta-Sn to alpha-Sn transition was monitored using electrical resistance measurements. The expansion and separation of the tin grains during the beta-Sn to alpha-Sn transition process were studied using scanning electron microscopy. The recrystallization of the alloy suppressed the tin pest phenomenon considerably since it decreased the number of defects in the crystal structure where heterogeneous nucleation of beta-Sn to alpha-Sn transition could occur. In the case of InSb inoculation, the spreading of the transition towards the bulk was as fast as the spreading parallel to the surface of the sample.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Materials

ISSN

1996-1944

e-ISSN

1996-1944

Svazek periodika

13

Číslo periodika v rámci svazku

4

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

11

Strana od-do

—

Kód UT WoS článku

000520419300159

EID výsledku v databázi Scopus

2-s2.0-85082088208