Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F18%3A00321249" target="_blank" >RIV/68407700:21230/18:00321249 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.sciencedirect.com/science/article/pii/S0017931018312973" target="_blank" >https://www.sciencedirect.com/science/article/pii/S0017931018312973</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.ijheatmasstransfer.2018.04.079" target="_blank" >10.1016/j.ijheatmasstransfer.2018.04.079</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering

Popis výsledku v původním jazyce

The reflow soldering process of large size components was always problematic in microelectronics manufacturing due to the possibility of component displacement failures after soldering; like tombstone formation or skewing, which can be traced back to the different heating of the opposite component sides. During vapour phase soldering, the efficiency of heat transfer highly depends on the thickness of the condensate layer. In this paper, the inhomogeneity of condensate layer formation and its effects were investigated at large size components during vapour phase soldering by numerical simulations. For this purpose, a 3D computational fluid dynamic model was established. According to the condensate layer formation in different cases, the onset differences in the melting of the solder alloy at the opposite leads of the component were calculated. By the results, the risk of the component displacement during reflow soldering was analysed. It was found, that the congestion of the condensate layer around the large size components can cause considerable differences in the onset of the solder alloy melting, which can yield in component displacement failures after soldering. The extent of difference in the onset of melting depends on the location of the component on the board and on the applied soak temperature. Keep-out zones on the board were suggested to reduce the possibility of the component displacement failures during the vapour phase soldering process.

Název v anglickém jazyce

Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering

Popis výsledku anglicky

The reflow soldering process of large size components was always problematic in microelectronics manufacturing due to the possibility of component displacement failures after soldering; like tombstone formation or skewing, which can be traced back to the different heating of the opposite component sides. During vapour phase soldering, the efficiency of heat transfer highly depends on the thickness of the condensate layer. In this paper, the inhomogeneity of condensate layer formation and its effects were investigated at large size components during vapour phase soldering by numerical simulations. For this purpose, a 3D computational fluid dynamic model was established. According to the condensate layer formation in different cases, the onset differences in the melting of the solder alloy at the opposite leads of the component were calculated. By the results, the risk of the component displacement during reflow soldering was analysed. It was found, that the congestion of the condensate layer around the large size components can cause considerable differences in the onset of the solder alloy melting, which can yield in component displacement failures after soldering. The extent of difference in the onset of melting depends on the location of the component on the board and on the applied soak temperature. Keep-out zones on the board were suggested to reduce the possibility of the component displacement failures during the vapour phase soldering process.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

International Journal of Heat and Mass Transfer

ISSN

0017-9310

e-ISSN

1879-2189

Svazek periodika

125

Číslo periodika v rámci svazku

Oct

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

8

Strana od-do

202-209

Kód UT WoS článku

000440118600016

EID výsledku v databázi Scopus

2-s2.0-85046120213