Effect of multiple reflow cycles on intermetallic compound creation

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925342" target="_blank" >RIV/49777513:23220/15:43925342 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247995&newsearch=true&queryText=Effect%20of%20multiple%20reflow%20cycles%20on%20intermetallic%20compound%20creation" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247995&newsearch=true&queryText=Effect%20of%20multiple%20reflow%20cycles%20on%20intermetallic%20compound%20creation</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2015.7247995" target="_blank" >10.1109/ISSE.2015.7247995</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of multiple reflow cycles on intermetallic compound creation

Popis výsledku v původním jazyce

This paper deals with the effect of the solder profile and multiple reflow cycles on intermetallic compound (IMC) creation. Soldered joints between PCB and 1206 size chip resistors were made from SAC 305 or SnBi solder alloy. Samples were reflowed one tosix times with one of the two different soldering profiles for each soldering alloys. The thickness and composition of IMC layers were measured and observed with a scanning electron microscope. The growing of IMC layers thickness was observed. The results are presented depending on greater value of heating factor and number of reflow cycles. The shear forces for the components were measured and the fracture interfaces were inspected.

Název v anglickém jazyce

Effect of multiple reflow cycles on intermetallic compound creation

Popis výsledku anglicky

This paper deals with the effect of the solder profile and multiple reflow cycles on intermetallic compound (IMC) creation. Soldered joints between PCB and 1206 size chip resistors were made from SAC 305 or SnBi solder alloy. Samples were reflowed one tosix times with one of the two different soldering profiles for each soldering alloys. The thickness and composition of IMC layers were measured and observed with a scanning electron microscope. The growing of IMC layers thickness was observed. The results are presented depending on greater value of heating factor and number of reflow cycles. The shear forces for the components were measured and the fracture interfaces were inspected.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regionální inovační centrum elektrotechniky (RICE)</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the 2015 38th International Spring Seminar on Electronics Technology (ISSE 2015)

ISBN

978-1-4799-8860-0

ISSN

2161-2528

e-ISSN

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Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Eger, Maďarsko

Datum konání akce

6. 5. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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