Application of More-level Stress on Conductive Adhesive Joints
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338501" target="_blank" >RIV/68407700:21230/19:00338501 - isvavai.cz</a>
Výsledek na webu
<a href="http://dx.doi.org/10.1109/SIITME47687.2019.8990770" target="_blank" >http://dx.doi.org/10.1109/SIITME47687.2019.8990770</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/SIITME47687.2019.8990770" target="_blank" >10.1109/SIITME47687.2019.8990770</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Application of More-level Stress on Conductive Adhesive Joints
Popis výsledku v původním jazyce
Three types of stresses have sequentially loaded adhesive joints formed of three types of adhesives with isotropic electrical conductivity. One type of joints has been prepared by mounting of jumpers (0R0 resistors, type 1206) on the test board. The second type of the joints has been formed by the printing of lines from adhesive between neighboring pads. The adhesive joints have been first stressed mechanically by deflection of the board with mounted resistors, then by the thermal shocks -40 oC/+80 oC and then at the combined climate 80 oC/80 % RH for 300 hours. The joints resistance has been measured. The mechanical stress, as well as stress caused by the thermal shocks have had an only low influence on the joints resistance, the combined climate temperature/humidity caused significant changes the joints resistance.
Název v anglickém jazyce
Application of More-level Stress on Conductive Adhesive Joints
Popis výsledku anglicky
Three types of stresses have sequentially loaded adhesive joints formed of three types of adhesives with isotropic electrical conductivity. One type of joints has been prepared by mounting of jumpers (0R0 resistors, type 1206) on the test board. The second type of the joints has been formed by the printing of lines from adhesive between neighboring pads. The adhesive joints have been first stressed mechanically by deflection of the board with mounted resistors, then by the thermal shocks -40 oC/+80 oC and then at the combined climate 80 oC/80 % RH for 300 hours. The joints resistance has been measured. The mechanical stress, as well as stress caused by the thermal shocks have had an only low influence on the joints resistance, the combined climate temperature/humidity caused significant changes the joints resistance.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2019
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)
ISBN
978-1-7281-3330-0
ISSN
2641-287X
e-ISSN
—
Počet stran výsledku
4
Strana od-do
142-145
Název nakladatele
Politehnica
Místo vydání
Bucharest
Místo konání akce
Cluj-Napoca
Datum konání akce
23. 10. 2019
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
000564733700029