Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00344951" target="_blank" >RIV/68407700:21230/20:00344951 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1108/SSMT-11-2019-0037" target="_blank" >https://doi.org/10.1108/SSMT-11-2019-0037</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/SSMT-11-2019-0037" target="_blank" >10.1108/SSMT-11-2019-0037</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Popis výsledku v původním jazyce

Purpose The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma'aiteh) and different printing speeds on the numerical results (e.g. pressure over stencil) of a numerical model regarding stencil printing. Design/methodology/approach A finite volume model was established for describing the printing process. Two types of viscosity models for non-Newtonian fluid properties were compared. The Cross model was fitted to the measurement results in the initial state of a lead-free solder paste, and the parameters of a Al-Ma'aiteh material model were fitted in the stabilised state of the same paste. Four different printing speeds were also investigated from 20 to 200 mm/s. Findings Noteworthy differences were found in the pressure between utilising the Cross model and the Al-Ma'aiteh viscosity model. The difference in pressure reached 33-34% for both printing speeds of 20 and 70 mm/s and reached 31% and 27% for the printing speed of 120 and 200 mm/s. The variation in the difference was explained by the increase in the rates of shear by increasing printing speeds. Originality/value Parameters of viscosity model should be determined for the stabilised state of the solder paste. Neglecting the thixotropic paste nature in the modelling of printing can cause a calculation error of even approximately 30%. By using the Al-Ma'aiteh viscosity model over the stabilised state of solder pastes can provide more accurate results in the modelling of printing, which is necessary for the effective optimisation of this process, and for eliminating soldering failures in highly integrated electronic devices.

Název v anglickém jazyce

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Popis výsledku anglicky

Purpose The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma'aiteh) and different printing speeds on the numerical results (e.g. pressure over stencil) of a numerical model regarding stencil printing. Design/methodology/approach A finite volume model was established for describing the printing process. Two types of viscosity models for non-Newtonian fluid properties were compared. The Cross model was fitted to the measurement results in the initial state of a lead-free solder paste, and the parameters of a Al-Ma'aiteh material model were fitted in the stabilised state of the same paste. Four different printing speeds were also investigated from 20 to 200 mm/s. Findings Noteworthy differences were found in the pressure between utilising the Cross model and the Al-Ma'aiteh viscosity model. The difference in pressure reached 33-34% for both printing speeds of 20 and 70 mm/s and reached 31% and 27% for the printing speed of 120 and 200 mm/s. The variation in the difference was explained by the increase in the rates of shear by increasing printing speeds. Originality/value Parameters of viscosity model should be determined for the stabilised state of the solder paste. Neglecting the thixotropic paste nature in the modelling of printing can cause a calculation error of even approximately 30%. By using the Al-Ma'aiteh viscosity model over the stabilised state of solder pastes can provide more accurate results in the modelling of printing, which is necessary for the effective optimisation of this process, and for eliminating soldering failures in highly integrated electronic devices.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Soldering & Surface Mount Technology

ISSN

0954-0911

e-ISSN

1758-6836

Svazek periodika

32

Číslo periodika v rámci svazku

4

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

5

Strana od-do

219-223

Kód UT WoS článku

000547273900001

EID výsledku v databázi Scopus

2-s2.0-85087115974