The effect of solder paste particle size on the thixotropic behaviour during stencil printing

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F18%3A00322176" target="_blank" >RIV/68407700:21230/18:00322176 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.sciencedirect.com/science/article/pii/S0924013618303236" target="_blank" >https://www.sciencedirect.com/science/article/pii/S0924013618303236</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.jmatprotec.2018.07.027" target="_blank" >10.1016/j.jmatprotec.2018.07.027</a>

Jazyk výsledku

angličtina

Název v původním jazyce

The effect of solder paste particle size on the thixotropic behaviour during stencil printing

Popis výsledku v původním jazyce

The thixotropic behaviour of different type lead-free solder pastes (Type 3: particle size: 20–45 μm; Type 4: 20–38 μm; Type 5: 10–25 μm) was investigated and compared. The viscosity decrease during the first stencil printing cycles is also described. The measurements were carried out with a rheometer using serrated parallel plates by sweeping the shear rate between 0.0015–100 s-1 with ten recordings per decade. Thixotropic behaviour of the solder pastes within the cycles of stencil printing was evaluated by including a “rest-period” between every rheological measurement to address the idle time between the printings. The “rest-period” was set to 15 s, 30 s and 60 s in this research The viscosity curve parameters η0 and ηinfinity were determined and were used to describe the viscosity change of solder pastes (from initial to stabilised state). Oscillatory stress sweep tests for different idle time periods were conducted in the stabilised state of the solder pastes. Significant difference was shown in the viscosity between the initial and the stabilised state of the solder paste; the η0 parameter decreased even to one thirds, and the ηinfinity decreased approximately to two thirds during the measurement cycles.

Název v anglickém jazyce

The effect of solder paste particle size on the thixotropic behaviour during stencil printing

Popis výsledku anglicky

The thixotropic behaviour of different type lead-free solder pastes (Type 3: particle size: 20–45 μm; Type 4: 20–38 μm; Type 5: 10–25 μm) was investigated and compared. The viscosity decrease during the first stencil printing cycles is also described. The measurements were carried out with a rheometer using serrated parallel plates by sweeping the shear rate between 0.0015–100 s-1 with ten recordings per decade. Thixotropic behaviour of the solder pastes within the cycles of stencil printing was evaluated by including a “rest-period” between every rheological measurement to address the idle time between the printings. The “rest-period” was set to 15 s, 30 s and 60 s in this research The viscosity curve parameters η0 and ηinfinity were determined and were used to describe the viscosity change of solder pastes (from initial to stabilised state). Oscillatory stress sweep tests for different idle time periods were conducted in the stabilised state of the solder pastes. Significant difference was shown in the viscosity between the initial and the stabilised state of the solder paste; the η0 parameter decreased even to one thirds, and the ηinfinity decreased approximately to two thirds during the measurement cycles.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Materials Processing Technology

ISSN

0924-0136

e-ISSN

—

Svazek periodika

262

Číslo periodika v rámci svazku

December

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

6

Strana od-do

571-576

Kód UT WoS článku

000445986900056

EID výsledku v databázi Scopus

2-s2.0-85050882918