Bond Strength Test of Soldering Pads with Various Surface Finishes Performed under Different Thermal Conditions
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00346642" target="_blank" >RIV/68407700:21230/20:00346642 - isvavai.cz</a>
Výsledek na webu
<a href="https://doi.org/10.1109/ISSE49702.2020.9121111" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9121111</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121111" target="_blank" >10.1109/ISSE49702.2020.9121111</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Bond Strength Test of Soldering Pads with Various Surface Finishes Performed under Different Thermal Conditions
Popis výsledku v původním jazyce
The goal of this study is to evaluate the bond between the soldering pad and the substrate in dependence on the solder pad finish as well as on ambient temperature. Stated differently, measuring of pulling force necessary for detaching the pad from the substrate is a subject of submitted study. A conventional substrate (laminate) made of woven glass cloth and epoxy resin with glass transition temperature value of 135 °C was available. OSP and HASL were chosen as surface finishes for evaluating the impact on the studied concern. Bond strength test was performed in room temperature and at an elevated temperature around 60 °C. An influence of IMC layers on test performing and results is included. Achieved results suggest a difference in the rate of adhesion of soldering pad to the substrate considering surface finish. However, other testing variables don't affect the pad adhesion significantly.
Název v anglickém jazyce
Bond Strength Test of Soldering Pads with Various Surface Finishes Performed under Different Thermal Conditions
Popis výsledku anglicky
The goal of this study is to evaluate the bond between the soldering pad and the substrate in dependence on the solder pad finish as well as on ambient temperature. Stated differently, measuring of pulling force necessary for detaching the pad from the substrate is a subject of submitted study. A conventional substrate (laminate) made of woven glass cloth and epoxy resin with glass transition temperature value of 135 °C was available. OSP and HASL were chosen as surface finishes for evaluating the impact on the studied concern. Bond strength test was performed in room temperature and at an elevated temperature around 60 °C. An influence of IMC layers on test performing and results is included. Achieved results suggest a difference in the rate of adhesion of soldering pad to the substrate considering surface finish. However, other testing variables don't affect the pad adhesion significantly.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2020
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
2020 43rd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-6773-2
ISSN
2161-2536
e-ISSN
2161-2528
Počet stran výsledku
5
Strana od-do
1-5
Název nakladatele
IEEE Press
Místo vydání
New York
Místo konání akce
Demanovska Valley
Datum konání akce
14. 5. 2020
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
000610543500065