Accelerated Aging of Bismuth-Tin Solder Joints on Various Substrates

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00341741" target="_blank" >RIV/68407700:21230/20:00341741 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE49702.2020.9120870" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9120870</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120870" target="_blank" >10.1109/ISSE49702.2020.9120870</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Accelerated Aging of Bismuth-Tin Solder Joints on Various Substrates

Popis výsledku v původním jazyce

This work aimed to evaluate a change of properties of Bi58Sn42 solder joints on different substrates during accelerated aging tests. Three different surface finishes of the copper soldering pads were chosen - Hot Air Solder Leveling (HASL), Galvanic Tin (GT), and Galvanic Nickel-Galvanic Gold (GNGG). Soldering pads without the surface finish were also used for comparison. The test boards with assembled chip resistors were aged in a climatic chamber at temperature 85 °C and relative humidity 85 % for 1512 hours. The measurement of electrical resistance and mechanical shear strength test was performed. Furthermore, metallographic cross-sections were made to evaluate the rate of intermetallic layer thickness growth. The intermetallic layers were also measured by Vickers hardness tester. The results showed that the growth of intermetallic layers and the increase of electrical resistance of the joints soldered on pads without surface protection, with HASL and GT, is similar; the resistance increased by up to 130%. On the contrary, joints on GNGG are more stable during aging. No significant difference was observed between resistance immediately after the soldering process and after the accelerated test. On the other hand, the hardness of Nickel-based intermetallic compounds, which grew between GNGG and the solder, pointed to greater fragility. The interpretation of the acquired results of such a comprehensive study leads to a better understanding of the solder joint reliability depending on the used surface finish of the printed circuit board.

Název v anglickém jazyce

Accelerated Aging of Bismuth-Tin Solder Joints on Various Substrates

Popis výsledku anglicky

This work aimed to evaluate a change of properties of Bi58Sn42 solder joints on different substrates during accelerated aging tests. Three different surface finishes of the copper soldering pads were chosen - Hot Air Solder Leveling (HASL), Galvanic Tin (GT), and Galvanic Nickel-Galvanic Gold (GNGG). Soldering pads without the surface finish were also used for comparison. The test boards with assembled chip resistors were aged in a climatic chamber at temperature 85 °C and relative humidity 85 % for 1512 hours. The measurement of electrical resistance and mechanical shear strength test was performed. Furthermore, metallographic cross-sections were made to evaluate the rate of intermetallic layer thickness growth. The intermetallic layers were also measured by Vickers hardness tester. The results showed that the growth of intermetallic layers and the increase of electrical resistance of the joints soldered on pads without surface protection, with HASL and GT, is similar; the resistance increased by up to 130%. On the contrary, joints on GNGG are more stable during aging. No significant difference was observed between resistance immediately after the soldering process and after the accelerated test. On the other hand, the hardness of Nickel-based intermetallic compounds, which grew between GNGG and the solder, pointed to greater fragility. The interpretation of the acquired results of such a comprehensive study leads to a better understanding of the solder joint reliability depending on the used surface finish of the printed circuit board.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-7281-6773-2

ISSN

2161-2536

e-ISSN

2161-2528

Počet stran výsledku

6

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Demanovska Valley

Datum konání akce

14. 5. 2020

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000610543500002