Analysis of a failure in a molded package caused by electrochemical migration

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00349986" target="_blank" >RIV/68407700:21230/21:00349986 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.engfailanal.2020.105128" target="_blank" >https://doi.org/10.1016/j.engfailanal.2020.105128</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.engfailanal.2020.105128" target="_blank" >10.1016/j.engfailanal.2020.105128</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Analysis of a failure in a molded package caused by electrochemical migration

Popis výsledku v původním jazyce

Electrical components can fail during their function in an electrical circuit, especially in a harsh environment. One of the possible failure reasons is the electrochemical migration, which leads to a short circuit or change of electrical parameters of components. This paper focuses on electrochemical effects and explains mechanisms leading to the formation of a conductive path within a component molded in a plastic package. Appropriate diagnostic methods SEM/EDS and penetration tests have been chosen in order to find the root cause for short circuit creation. It was found that the conductive path appeared due to electrochemical migration of silver between the Electrically Conductive Adhesive (ECA) joints connecting the capacitor package. A tiny gap that was found between the molding compound and the leadframe of the package, showed to be the necessary condition for the electrochemical migration to appear. The main aim of this work was not just to identify the cause of an inadvertent conductive path creation, but also to identify the part of the manufacturing process, where similar problems can be prevented.

Název v anglickém jazyce

Analysis of a failure in a molded package caused by electrochemical migration

Popis výsledku anglicky

Electrical components can fail during their function in an electrical circuit, especially in a harsh environment. One of the possible failure reasons is the electrochemical migration, which leads to a short circuit or change of electrical parameters of components. This paper focuses on electrochemical effects and explains mechanisms leading to the formation of a conductive path within a component molded in a plastic package. Appropriate diagnostic methods SEM/EDS and penetration tests have been chosen in order to find the root cause for short circuit creation. It was found that the conductive path appeared due to electrochemical migration of silver between the Electrically Conductive Adhesive (ECA) joints connecting the capacitor package. A tiny gap that was found between the molding compound and the leadframe of the package, showed to be the necessary condition for the electrochemical migration to appear. The main aim of this work was not just to identify the cause of an inadvertent conductive path creation, but also to identify the part of the manufacturing process, where similar problems can be prevented.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Engineering Failure Analysis

ISSN

1350-6307

e-ISSN

1873-1961

Svazek periodika

121

Číslo periodika v rámci svazku

105128

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

8

Strana od-do

1-8

Kód UT WoS článku

000613158000005

EID výsledku v databázi Scopus

2-s2.0-85098688238