A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F24%3APU149175" target="_blank" >RIV/00216305:26220/24:PU149175 - isvavai.cz</a>

Výsledek na webu

<a href="https://asmedigitalcollection.asme.org/electronicpackaging/article/146/1/011004/1163287/A-Contribution-to-Printed-Circuit-Boards" target="_blank" >https://asmedigitalcollection.asme.org/electronicpackaging/article/146/1/011004/1163287/A-Contribution-to-Printed-Circuit-Boards</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1115/1.4062470" target="_blank" >10.1115/1.4062470</a>

Jazyk výsledku

angličtina

Název v původním jazyce

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Popis výsledku v původním jazyce

This study describes a novel and unconventional approach for embedding passive surface mounted device (SMD) components into printed circuit boards. Therefore, passive components whose package size is 0201 are embedded in two types of vias. On the final quality of an embedded passive component, the effects of various technological factors, including tin-lead and lead-free solder pastes, various types and dimensions of vias, various soldering techniques, and sample positions during the reflow process, have been investigated and described. The results show the impact of tin-lead solder paste and polymeric solder paste on the creation of electrical shorts in the embedding of passive components. The application of microvias for the embedding of passive components eliminates the fundamental issues, such as electrical shorts, component dislocation, and the low success rate for creating a reliable solder joint. The proposed method for miniaturizing printed circuit boards by embedding passive components in microvias was verified by experimental results. The reliability of the proposed methodology is further supported by electrical measurements. This study describes an approach suitable to printed circuit board (PCB) prototyping that makes a negligible contribution to hardware design and electronic technologies.

Název v anglickém jazyce

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Popis výsledku anglicky

This study describes a novel and unconventional approach for embedding passive surface mounted device (SMD) components into printed circuit boards. Therefore, passive components whose package size is 0201 are embedded in two types of vias. On the final quality of an embedded passive component, the effects of various technological factors, including tin-lead and lead-free solder pastes, various types and dimensions of vias, various soldering techniques, and sample positions during the reflow process, have been investigated and described. The results show the impact of tin-lead solder paste and polymeric solder paste on the creation of electrical shorts in the embedding of passive components. The application of microvias for the embedding of passive components eliminates the fundamental issues, such as electrical shorts, component dislocation, and the low success rate for creating a reliable solder joint. The proposed method for miniaturizing printed circuit boards by embedding passive components in microvias was verified by experimental results. The reliability of the proposed methodology is further supported by electrical measurements. This study describes an approach suitable to printed circuit board (PCB) prototyping that makes a negligible contribution to hardware design and electronic technologies.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

JOURNAL OF ELECTRONIC PACKAGING

ISSN

1043-7398

e-ISSN

1528-9044

Svazek periodika

146

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

12

Strana od-do

„011004-1“-„011004-12“

Kód UT WoS článku

001154980300004

EID výsledku v databázi Scopus

2-s2.0-85175302134