Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358701" target="_blank" >RIV/68407700:21230/22:00358701 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE54558.2022.9812828" target="_blank" >https://doi.org/10.1109/ISSE54558.2022.9812828</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812828" target="_blank" >10.1109/ISSE54558.2022.9812828</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading

Popis výsledku v původním jazyce

Due to the restrictions on lead solder alloy, there is an ongoing search for alternative lead-free alloys with the best possible solder properties similar to Pb-based solder alloys. Therefore, phosphorus and gallium are, for example, added to solder alloys, which could lead to an improvement in their solder properties (wettability, mechanical, lower melting point). These additives are usually used for the improvement of SAC alloys. This work focused on lead-free low-temperature solders based on tin and bismuth. The effect of added 1 wt.% gallium and traces of phosphorus on wettability and spreading was studied. These properties were observed on FR4 boards with three different surface materials: copper, copper with hot air solder leveling surface finish (HASL) and copper with electroless nickel-immersion gold surface finish (ENIG). Examined alloys were Bi58Sn42, Bi58Sn42P, Bi59Sn40Ga1 and Bi59Sn40Ga1P. The results showed that although the addition of Ga and P exhibited no significant improvement or even decrease in the wetting and spreading ability of the solder alloy on copper and ENIG surfaces, the wetting behavior of the doped alloys was better on HASL surface compared to the eutectic solder alloy.

Název v anglickém jazyce

Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading

Popis výsledku anglicky

Due to the restrictions on lead solder alloy, there is an ongoing search for alternative lead-free alloys with the best possible solder properties similar to Pb-based solder alloys. Therefore, phosphorus and gallium are, for example, added to solder alloys, which could lead to an improvement in their solder properties (wettability, mechanical, lower melting point). These additives are usually used for the improvement of SAC alloys. This work focused on lead-free low-temperature solders based on tin and bismuth. The effect of added 1 wt.% gallium and traces of phosphorus on wettability and spreading was studied. These properties were observed on FR4 boards with three different surface materials: copper, copper with hot air solder leveling surface finish (HASL) and copper with electroless nickel-immersion gold surface finish (ENIG). Examined alloys were Bi58Sn42, Bi58Sn42P, Bi59Sn40Ga1 and Bi59Sn40Ga1P. The results showed that although the addition of Ga and P exhibited no significant improvement or even decrease in the wetting and spreading ability of the solder alloy on copper and ENIG surfaces, the wetting behavior of the doped alloys was better on HASL surface compared to the eutectic solder alloy.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2022 45th International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-6654-6589-2

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Vienna

Datum konání akce

11. 5. 2022

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853642200067