Influence of No-Clean Flux on The Corrosivity of Copper After Reflow

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358743" target="_blank" >RIV/68407700:21230/22:00358743 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE54558.2022.9812708" target="_blank" >https://doi.org/10.1109/ISSE54558.2022.9812708</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812708" target="_blank" >10.1109/ISSE54558.2022.9812708</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of No-Clean Flux on The Corrosivity of Copper After Reflow

Popis výsledku v původním jazyce

The use of flux when soldering is essential to obtain a reliable solder joint. No-clean fluxes are most often used in lead-free soldering. This raises the question of the need to clean the flux residues due to their aggressiveness. The purpose of this work is to understand the importance of the flux chemistry and impact of weak organic acids (WOAs) on the corrosivity of copper surface after reflow. During this investigation the aggressiveness of six different no-clean fluxes for lead-free soldering on toward copper surface was observed. The results showed the flux aggressiveness depended on the flux composition. Fluxes Weller Lötwasser and Topnik RF800 showed less aggressive effect toward copper surface after heat treatment. The results of the study also showed that one of more aggressive fluxes, such as Topnik LP-1, corroded the copper surface to a depth of about 50 μm.

Název v anglickém jazyce

Influence of No-Clean Flux on The Corrosivity of Copper After Reflow

Popis výsledku anglicky

The use of flux when soldering is essential to obtain a reliable solder joint. No-clean fluxes are most often used in lead-free soldering. This raises the question of the need to clean the flux residues due to their aggressiveness. The purpose of this work is to understand the importance of the flux chemistry and impact of weak organic acids (WOAs) on the corrosivity of copper surface after reflow. During this investigation the aggressiveness of six different no-clean fluxes for lead-free soldering on toward copper surface was observed. The results showed the flux aggressiveness depended on the flux composition. Fluxes Weller Lötwasser and Topnik RF800 showed less aggressive effect toward copper surface after heat treatment. The results of the study also showed that one of more aggressive fluxes, such as Topnik LP-1, corroded the copper surface to a depth of about 50 μm.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2022 45th International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-6654-6589-2

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Vienna

Datum konání akce

11. 5. 2022

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853642200002