The Medipix3RX: a high resolution, zero dead-time pixel detector readout chip allowing spectroscopic imaging

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21670%2F13%3A00217185" target="_blank" >RIV/68407700:21670/13:00217185 - isvavai.cz</a>

Výsledek na webu

<a href="http://iopscience.iop.org/1748-0221/8/02/C02016" target="_blank" >http://iopscience.iop.org/1748-0221/8/02/C02016</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1088/1748-0221/8/02/C02016" target="_blank" >10.1088/1748-0221/8/02/C02016</a>

Jazyk výsledku

angličtina

Název v původním jazyce

The Medipix3RX: a high resolution, zero dead-time pixel detector readout chip allowing spectroscopic imaging

Popis výsledku v původním jazyce

The Medipix3 chips have been designed to permit spectroscopic imaging in highly segmented hybrid pixel detectors. Spectral degradation due to charge sharing in the sensor has been addressed by means of an architecture in which adjacent pixels communicatein the analog and digital domains on an event-by-event basis to reconstruct the deposited charge in a neighbourhood prior to the assignation of the hit to a single pixel. The Medipix3RX chip architecture is presented. The first results for the characterization of the chip with 300 ?m thick Si sensors are given. Similar to 72e^- r.m.s. noise and similar to 40e^- r.m.s. of threshold dispersion after chip equalization have been measured in Single Pixel Mode of operation. The homogeneity of the image in Charge Summing mode is comparable to the Single Pixel Mode image. This demonstrates both modes are suitable for X-ray imaging applications.

Název v anglickém jazyce

The Medipix3RX: a high resolution, zero dead-time pixel detector readout chip allowing spectroscopic imaging

Popis výsledku anglicky

The Medipix3 chips have been designed to permit spectroscopic imaging in highly segmented hybrid pixel detectors. Spectral degradation due to charge sharing in the sensor has been addressed by means of an architecture in which adjacent pixels communicatein the analog and digital domains on an event-by-event basis to reconstruct the deposited charge in a neighbourhood prior to the assignation of the hit to a single pixel. The Medipix3RX chip architecture is presented. The first results for the characterization of the chip with 300 ?m thick Si sensors are given. Similar to 72e^- r.m.s. noise and similar to 40e^- r.m.s. of threshold dispersion after chip equalization have been measured in Single Pixel Mode of operation. The homogeneity of the image in Charge Summing mode is comparable to the Single Pixel Mode image. This demonstrates both modes are suitable for X-ray imaging applications.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BG - Jaderná, atomová a molekulová fyzika, urychlovače

OECD FORD obor

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Projekt

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Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

JOURNAL OF INSTRUMENTATION

ISSN

1748-0221

e-ISSN

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Svazek periodika

8

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

16

Strana od-do

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Kód UT WoS článku

000315672700016

EID výsledku v databázi Scopus

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