Experimental Study of the Influence of the Temperature Profile on the BGA Soldering

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F16%3A10328838" target="_blank" >RIV/00216208:11320/16:10328838 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/16:00303323

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563190" target="_blank" >http://dx.doi.org/10.1109/ISSE.2016.7563190</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563190" target="_blank" >10.1109/ISSE.2016.7563190</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Experimental Study of the Influence of the Temperature Profile on the BGA Soldering

Popis výsledku v původním jazyce

One of the most favour components, which are mounted on the printed circuit board (PCB), is Ball Grid Array (BGA) due to higher integration. On the other hand BGAs are components which are the most problematic from point of solder interconnection reliability. The aim of this work was to make experimental study of the influence of the temperature profile on the BGA soldering during its reworks on electronic equipments from point of observing the distance between the PCB and BGA package. Five temperature profiles were used with following maximum temperature in peak 239 degrees C, 246 degrees C, 253 degrees C, 255 degrees C and 259 degrees C. X-ray diagnostic of the distances between the BGA package and PCB were used with the inspection angle 45 degrees. Three BGAs were soldered and inspected for each temperature profile. The issues were found only in case when was used the temperature profile with highest maximum temperature.

Název v anglickém jazyce

Experimental Study of the Influence of the Temperature Profile on the BGA Soldering

Popis výsledku anglicky

One of the most favour components, which are mounted on the printed circuit board (PCB), is Ball Grid Array (BGA) due to higher integration. On the other hand BGAs are components which are the most problematic from point of solder interconnection reliability. The aim of this work was to make experimental study of the influence of the temperature profile on the BGA soldering during its reworks on electronic equipments from point of observing the distance between the PCB and BGA package. Five temperature profiles were used with following maximum temperature in peak 239 degrees C, 246 degrees C, 253 degrees C, 255 degrees C and 259 degrees C. X-ray diagnostic of the distances between the BGA package and PCB were used with the inspection angle 45 degrees. Three BGAs were soldered and inspected for each temperature profile. The issues were found only in case when was used the temperature profile with highest maximum temperature.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

<a href="/cs/project/LM2011025" target="_blank" >LM2011025: LMNT - Laboratoře magnetizmu a nízkých teplot - provoz a rozvoj národní výzkumné infrastruktury</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2016 39TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE)

ISBN

978-1-5090-1389-0

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

4

Strana od-do

210-213

Název nakladatele

IEEE

Místo vydání

NEW YORK

Místo konání akce

Pilsen

Datum konání akce

18. 5. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000387089800041