How to rework underfilled BGA

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00303262" target="_blank" >RIV/68407700:21230/16:00303262 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

How to rework underfilled BGA

Popis výsledku v původním jazyce

A Ball Grid Array (BGA) component has become one of the most popular packaging alternatives for high density integrated electronics devices. BGA packages become smaller and electrical equipment has become lighter, therefore such equipment is more sensitive to mechanical stress. Therefore the underfill of the chips is used to improve the lifetime and reliability of electronic equipment. On the other hand there are issues with removing of the underfilled component from the printed circuit board (PCB) without damaging the PCB together with soldering pads. The goal of this article is to present the rework possibility of underfilled components, when a very fine milling machine was developed for the components rework purposes in LVR at CTU in Prague.

Název v anglickém jazyce

How to rework underfilled BGA

Popis výsledku anglicky

A Ball Grid Array (BGA) component has become one of the most popular packaging alternatives for high density integrated electronics devices. BGA packages become smaller and electrical equipment has become lighter, therefore such equipment is more sensitive to mechanical stress. Therefore the underfill of the chips is used to improve the lifetime and reliability of electronic equipment. On the other hand there are issues with removing of the underfilled component from the printed circuit board (PCB) without damaging the PCB together with soldering pads. The goal of this article is to present the rework possibility of underfilled components, when a very fine milling machine was developed for the components rework purposes in LVR at CTU in Prague.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/LO1505" target="_blank" >LO1505: Podpora udržitelnosti Laboratoří pro vývoj a realizaci ČVUT v Praze</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

ElectroScope

ISSN

1802-4564

e-ISSN

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Svazek periodika

2016

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

CZ - Česká republika

Počet stran výsledku

3

Strana od-do

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Kód UT WoS článku

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EID výsledku v databázi Scopus

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