Influence of Latent Heat on the Shape of Temperature Profile for Different Types of Solder Alloys

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F16%3A10328839" target="_blank" >RIV/00216208:11320/16:10328839 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/16:00303325

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563191" target="_blank" >http://dx.doi.org/10.1109/ISSE.2016.7563191</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563191" target="_blank" >10.1109/ISSE.2016.7563191</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of Latent Heat on the Shape of Temperature Profile for Different Types of Solder Alloys

Popis výsledku v původním jazyce

Temperature profile is a very important parameter which has a high impact on reliability issues in electronic assembly manufacturing. The wrong shape of temperature profile (temperature/cooling gradients, maximum temperature, preheat together with flux activation) can lead to issues like flux/solder spattering, pad cratering, unwetting, excessive interrmetallic growth, tombstone effect shrinkage etc. This article deals with influence of latent heat on the shape of temperature profile, which starts to be more attractive due to higher integrity of electronics equipment. The experiments were based of two lead-free solder alloys (Sn96.5Ag3.5, Sn96.5Ag3Cu0.5), which were remelted on the copper pads in continual convection furnace. The temperature profile, were measured directly under the copper pads. Results shows, that the measured temperature profiles under soldering pads differs against the temperature profile which were measured on the PCB. Additionally the temperature profiles which were measured under soldering pads differ according to used solder alloys as well.

Název v anglickém jazyce

Influence of Latent Heat on the Shape of Temperature Profile for Different Types of Solder Alloys

Popis výsledku anglicky

Temperature profile is a very important parameter which has a high impact on reliability issues in electronic assembly manufacturing. The wrong shape of temperature profile (temperature/cooling gradients, maximum temperature, preheat together with flux activation) can lead to issues like flux/solder spattering, pad cratering, unwetting, excessive interrmetallic growth, tombstone effect shrinkage etc. This article deals with influence of latent heat on the shape of temperature profile, which starts to be more attractive due to higher integrity of electronics equipment. The experiments were based of two lead-free solder alloys (Sn96.5Ag3.5, Sn96.5Ag3Cu0.5), which were remelted on the copper pads in continual convection furnace. The temperature profile, were measured directly under the copper pads. Results shows, that the measured temperature profiles under soldering pads differs against the temperature profile which were measured on the PCB. Additionally the temperature profiles which were measured under soldering pads differ according to used solder alloys as well.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

<a href="/cs/project/LM2011025" target="_blank" >LM2011025: LMNT - Laboratoře magnetizmu a nízkých teplot - provoz a rozvoj národní výzkumné infrastruktury</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2016 39TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE)

ISBN

978-1-5090-1389-0

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

4

Strana od-do

214-217

Název nakladatele

IEEE

Místo vydání

NEW YORK

Místo konání akce

Pilsen

Datum konání akce

18. 5. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000387089800042