On the stability of Ag, Cu, and Sn nanoparticles
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F09%3A00049590" target="_blank" >RIV/00216224:14310/09:00049590 - isvavai.cz</a>
Výsledek na webu
—
DOI - Digital Object Identifier
—
Alternativní jazyky
Jazyk výsledku
čeština
Název v původním jazyce
On the stability of Ag, Cu, and Sn nanoparticles
Popis výsledku v původním jazyce
Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected.
Název v anglickém jazyce
On the stability of Ag, Cu, and Sn nanoparticles
Popis výsledku anglicky
Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected.
Klasifikace
Druh
O - Ostatní výsledky
CEP obor
CF - Fyzikální chemie a teoretická chemie
OECD FORD obor
—
Návaznosti výsledku
Projekt
Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2009
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů