Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F22%3A00119220" target="_blank" >RIV/00216224:14310/22:00119220 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1007/978-981-16-5763-4_15" target="_blank" >https://doi.org/10.1007/978-981-16-5763-4_15</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/978-981-16-5763-4_15" target="_blank" >10.1007/978-981-16-5763-4_15</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics

Popis výsledku v původním jazyce

Low-temperature plasma processing of surfaces and interfaces is an interesting option for applications in flexible and printed electronics where surface cleaning, activation or functionalization are required. Plasma processing compared to more traditional chemical treatment can be significantly cheaper and faster while eliminating the need for toxic organic solvents. Printed functional coatings often contain organic moieties from solvents, binders and other additives that tune the properties of the precursor liquid. These need to be effectively removed for optimal properties of the resulting film. Plasma can provide reactive and energetic species to the surface of printed films for post-printing processing at significantly lower temperatures compared to conventional thermal annealing. In this paper, we summarize applications of low-temperature atmospheric plasma for cleaning of indium tin oxide (ITO) and fluorine-doped tin oxide (FTO) substrates for improved interface quality between the electrode and the blocking layer in perovskite solar cells. Plasma treatment in order of seconds proved as effective as a chemical treatment for an hour. We also present a way for post-deposition mineralization of mesoporous TiO2 electron transport layer for perovskite solar cells at temperatures below 70 °C compatible with temperature-sensitive substrates.

Název v anglickém jazyce

Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics

Popis výsledku anglicky

Low-temperature plasma processing of surfaces and interfaces is an interesting option for applications in flexible and printed electronics where surface cleaning, activation or functionalization are required. Plasma processing compared to more traditional chemical treatment can be significantly cheaper and faster while eliminating the need for toxic organic solvents. Printed functional coatings often contain organic moieties from solvents, binders and other additives that tune the properties of the precursor liquid. These need to be effectively removed for optimal properties of the resulting film. Plasma can provide reactive and energetic species to the surface of printed films for post-printing processing at significantly lower temperatures compared to conventional thermal annealing. In this paper, we summarize applications of low-temperature atmospheric plasma for cleaning of indium tin oxide (ITO) and fluorine-doped tin oxide (FTO) substrates for improved interface quality between the electrode and the blocking layer in perovskite solar cells. Plasma treatment in order of seconds proved as effective as a chemical treatment for an hour. We also present a way for post-deposition mineralization of mesoporous TiO2 electron transport layer for perovskite solar cells at temperatures below 70 °C compatible with temperature-sensitive substrates.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

10305 - Fluids and plasma physics (including surface physics)

Projekt

<a href="/cs/project/GJ19-14770Y" target="_blank" >GJ19-14770Y: Plazmatem produkované nanostrukturované vrstvy pro flexibilní materiály nové generace</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the 2nd International Conference on Advanced Surface Enhancement (INCASE 2021)

ISBN

9789811657627

ISSN

2195-4356

e-ISSN

2195-4364

Počet stran výsledku

4

Strana od-do

66-69

Název nakladatele

Springer

Místo vydání

Singapore

Místo konání akce

virtual (Online)

Datum konání akce

7. 9. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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