In situ measurements of surface homogeneity of optical parameters of weakly absorbing thin films

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F02%3APU29191" target="_blank" >RIV/00216305:26210/02:PU29191 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

In situ measurements of surface homogeneity of optical parameters of weakly absorbing thin films

Popis výsledku v původním jazyce

In the paper the instrument working on the principles of spectral reflectivity and designed in our group for in situ monitoring of surface homogeneity of optical parameters of weakly absorbing thin films was tested in a series of ex- and in situ experiments. The tests confirmed that it is a convenient tool for the in situ quasi-real time monitoring of surface homogeneity of thicknesses and optical parameters of small area thin films (up to 1 cm2) during their etching and growth. By this method a homogenneous growth of an SiO2 film with an average growth rate of 103 nm/hour in one pilot point during the deposition by ion beam sputtering of a quartz target was monitored in situ. On the other hand, the ion beam etching rate of the thermal SiO2 film was lower than 3.3 nm/min and the enhanced roughness of the etched film in comparison to the initial one was observed.

Název v anglickém jazyce

In situ measurements of surface homogeneity of optical parameters of weakly absorbing thin films

Popis výsledku anglicky

In the paper the instrument working on the principles of spectral reflectivity and designed in our group for in situ monitoring of surface homogeneity of optical parameters of weakly absorbing thin films was tested in a series of ex- and in situ experiments. The tests confirmed that it is a convenient tool for the in situ quasi-real time monitoring of surface homogeneity of thicknesses and optical parameters of small area thin films (up to 1 cm2) during their etching and growth. By this method a homogenneous growth of an SiO2 film with an average growth rate of 103 nm/hour in one pilot point during the deposition by ion beam sputtering of a quartz target was monitored in situ. On the other hand, the ion beam etching rate of the thermal SiO2 film was lower than 3.3 nm/min and the enhanced roughness of the etched film in comparison to the initial one was observed.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BH - Optika, masery a lasery

OECD FORD obor

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Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2002

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Surface and Interface Analysis

ISSN

0142-2421

e-ISSN

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Svazek periodika

34

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

4

Strana od-do

664-667

Kód UT WoS článku

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EID výsledku v databázi Scopus

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