Bezolovnaté pájení a smáčení povrchu substrátu pájkou

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU45759" target="_blank" >RIV/00216305:26220/04:PU45759 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Solder Wetting of Substrate Surface in Lead Free Soldering

Popis výsledku v původním jazyce

Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE ? Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs someknowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joointreliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces ? melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process ? wetting phenomena especially wetting angle and wetting angle hy

Název v anglickém jazyce

Solder Wetting of Substrate Surface in Lead Free Soldering

Popis výsledku anglicky

Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE ? Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs someknowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joointreliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces ? melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process ? wetting phenomena especially wetting angle and wetting angle hy

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2004

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

The 11th Electronic Devices and Systems Conference

ISBN

80-214-2701-9

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

394-398

Název nakladatele

VUT v Brně

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

9. 9. 2004

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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