The students' workplace for special components soldering and inspection

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU83864" target="_blank" >RIV/00216305:26220/09:PU83864 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

The students' workplace for special components soldering and inspection

Popis výsledku v původním jazyce

Expansion of microelectronics technologies is very fast. An education on high schools and universities must be conformed to these new trends and new technologies, which are a base for new education methods. This paper is focused to the problematic of interconnections and the implementation of new trends of modern soldering technologies and modern equipment into education process; concretely in courses, which are specialized to modern technologies of electronic circuits and systems. The possibilities of3-D structures and soldering of BGA components using own prepared samples are presented. Samples are made from ceramic and organic materials. The solder paste was deposited to the samples by stencil printing techniques and samples were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection was made by optical inspection device Ersascope. Finally it was found that this process is suitable for practical education.

Název v anglickém jazyce

The students' workplace for special components soldering and inspection

Popis výsledku anglicky

Expansion of microelectronics technologies is very fast. An education on high schools and universities must be conformed to these new trends and new technologies, which are a base for new education methods. This paper is focused to the problematic of interconnections and the implementation of new trends of modern soldering technologies and modern equipment into education process; concretely in courses, which are specialized to modern technologies of electronic circuits and systems. The possibilities of3-D structures and soldering of BGA components using own prepared samples are presented. Samples are made from ceramic and organic materials. The solder paste was deposited to the samples by stencil printing techniques and samples were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection was made by optical inspection device Ersascope. Finally it was found that this process is suitable for practical education.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/2E08051" target="_blank" >2E08051: Výzkum metod a postupů pro seznámení veřejnosti s prací výzkumného pracovníka prostřednictvím informačních technologií</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

EDS '09 IMAPS CS International Conference Proceedings

ISBN

978-80-214-3933-7

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

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Název nakladatele

NOVPRESS s.r.o.

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

2. 9. 2009

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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