New trends of BGA Soldering in education

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU83867" target="_blank" >RIV/00216305:26220/09:PU83867 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

New trends of BGA Soldering in education

Popis výsledku v původním jazyce

This paper deals with the problematic of modern soldering technologies and the implementation of new trends of modern soldering technologies into education process. It describes the possibilities of implementation of modern equipment in the education process, concretely in courses specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and BGA soldering using own prepared ceramic and organic based samples were presented. The samples with deposited solder paste using stencil printing techniques were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection of soldered joints was made using Ersascope special optical inspection device. Finally it was found that this process is suitable for practical education in the lessons of modern packaging and systems subjects.

Název v anglickém jazyce

New trends of BGA Soldering in education

Popis výsledku anglicky

This paper deals with the problematic of modern soldering technologies and the implementation of new trends of modern soldering technologies into education process. It describes the possibilities of implementation of modern equipment in the education process, concretely in courses specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and BGA soldering using own prepared ceramic and organic based samples were presented. The samples with deposited solder paste using stencil printing techniques were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection of soldered joints was made using Ersascope special optical inspection device. Finally it was found that this process is suitable for practical education in the lessons of modern packaging and systems subjects.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/2E08051" target="_blank" >2E08051: Výzkum metod a postupů pro seznámení veřejnosti s prací výzkumného pracovníka prostřednictvím informačních technologií</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Electronics

ISSN

1313-1842

e-ISSN

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Svazek periodika

3

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

BG - Bulharská republika

Počet stran výsledku

3

Strana od-do

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Kód UT WoS článku

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EID výsledku v databázi Scopus

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