Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU96942" target="_blank" >RIV/00216305:26220/11:PU96942 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

Popis výsledku v původním jazyce

The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment. In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printedcircuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model. To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assembl

Název v anglickém jazyce

Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

Popis výsledku anglicky

The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment. In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printedcircuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model. To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assembl

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/FR-TI1%2F072" target="_blank" >FR-TI1/072: Aplikace moderních montážních technologií a materiálů v elektrotechnickém průmyslu</a><br>

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

18th European microelectronics packaging conference EMPC 2011 - Proceedings

ISBN

978-0-9568086-0-8

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

210-214

Název nakladatele

Neuveden

Místo vydání

Brihton, UK

Místo konání akce

Brighton

Datum konání akce

12. 9. 2011

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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