Nanostructured anodic-alumina-based dielectrics for high-frequency integral capacitors
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU101609" target="_blank" >RIV/00216305:26220/12:PU101609 - isvavai.cz</a>
Výsledek na webu
<a href="http://www.sciencedirect.com/science/article/pii/S0040609012002295#" target="_blank" >http://www.sciencedirect.com/science/article/pii/S0040609012002295#</a>
DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Nanostructured anodic-alumina-based dielectrics for high-frequency integral capacitors
Popis výsledku v původním jazyce
Three types of thin solid films with the nanoscale inner structures were synthesized by sputtering-deposition and anodizing of Al layer, Al-Si alloy layer, and Al/Ta bilayer on Si wafers. All the anodic films comprised nanoporous alumina layer as the key component. The essential differences were due to the silicon impurities (AlSi alloy) and the array of nanosized tantalum oxide protrusions in the alumina barrier layer (Al/Ta bilayer). The films were examined by scanning and transmission electron microscopy and electrochemical impedance spectroscopy. Integral capacitors utilizing the anodic films as dielectrics combine the small-value capacitance (6.5 nF cm-2) with the excellent properties of high withstand field strength, low leakage current, and low loss tangent. The revealed dispersion of dielectric constant, and the presence of loss peaks on the temperature and frequency dependencies of losses denote the influence of ion-relaxation mechanism on dielectrics polarizability, with the characteristic times depending on the dielectric type. By selecting appropriate technological and electrolytic conditions, the functionality of the capacitors can be optimized to meet the needs of a specific range, from 1 kHz to about 300 MHz operating frequencies.
Název v anglickém jazyce
Nanostructured anodic-alumina-based dielectrics for high-frequency integral capacitors
Popis výsledku anglicky
Three types of thin solid films with the nanoscale inner structures were synthesized by sputtering-deposition and anodizing of Al layer, Al-Si alloy layer, and Al/Ta bilayer on Si wafers. All the anodic films comprised nanoporous alumina layer as the key component. The essential differences were due to the silicon impurities (AlSi alloy) and the array of nanosized tantalum oxide protrusions in the alumina barrier layer (Al/Ta bilayer). The films were examined by scanning and transmission electron microscopy and electrochemical impedance spectroscopy. Integral capacitors utilizing the anodic films as dielectrics combine the small-value capacitance (6.5 nF cm-2) with the excellent properties of high withstand field strength, low leakage current, and low loss tangent. The revealed dispersion of dielectric constant, and the presence of loss peaks on the temperature and frequency dependencies of losses denote the influence of ion-relaxation mechanism on dielectrics polarizability, with the characteristic times depending on the dielectric type. By selecting appropriate technological and electrolytic conditions, the functionality of the capacitors can be optimized to meet the needs of a specific range, from 1 kHz to about 300 MHz operating frequencies.
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
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Návaznosti výsledku
Projekt
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Návaznosti
R - Projekt Ramcoveho programu EK
Ostatní
Rok uplatnění
2012
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Thin Solid Films
ISSN
0040-6090
e-ISSN
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Svazek periodika
-
Číslo periodika v rámci svazku
-
Stát vydavatele periodika
US - Spojené státy americké
Počet stran výsledku
9
Strana od-do
1-9
Kód UT WoS článku
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EID výsledku v databázi Scopus
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