Investigation of the Mechanical Properties of Lead-Free Solder Materials

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F13%3APU106903" target="_blank" >RIV/00216305:26220/13:PU106903 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.scientific.net/KEM.592-593.453" target="_blank" >http://www.scientific.net/KEM.592-593.453</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4028/www.scientific.net/KEM.592-593.453" target="_blank" >10.4028/www.scientific.net/KEM.592-593.453</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Investigation of the Mechanical Properties of Lead-Free Solder Materials

Popis výsledku v původním jazyce

Reliability and life-time of electric/electronic products is still a highly actual and discussed topic. Every electric/electronic product is heterogeneous system which consists not only from components and constructional parts, but also from many interconnections. Basic segments of interconnection are solder joints, actually created by lead-free materials. The passing from well-proven lead solders to lead free compositions brought many new aspects in reliability and life-time of electronic systems. Someof the negative factors are their poor electro-mechanical properties, which are based on complicated microstructure of interlayer interface. This fact causes defects in solder joints and consequential failure of the function. This article is focused onan investigation of mechanical properties by lead-free solder joints. There are investigated various properties of common lead free solder paste depending on various concentrations of O2 by reflow process. Next, there are shown microstruc

Název v anglickém jazyce

Investigation of the Mechanical Properties of Lead-Free Solder Materials

Popis výsledku anglicky

Reliability and life-time of electric/electronic products is still a highly actual and discussed topic. Every electric/electronic product is heterogeneous system which consists not only from components and constructional parts, but also from many interconnections. Basic segments of interconnection are solder joints, actually created by lead-free materials. The passing from well-proven lead solders to lead free compositions brought many new aspects in reliability and life-time of electronic systems. Someof the negative factors are their poor electro-mechanical properties, which are based on complicated microstructure of interlayer interface. This fact causes defects in solder joints and consequential failure of the function. This article is focused onan investigation of mechanical properties by lead-free solder joints. There are investigated various properties of common lead free solder paste depending on various concentrations of O2 by reflow process. Next, there are shown microstruc

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Key Engineering Materials (web)

ISSN

1662-9795

e-ISSN

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Svazek periodika

2013

Číslo periodika v rámci svazku

592-593

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

4

Strana od-do

453-456

Kód UT WoS článku

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EID výsledku v databázi Scopus

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