Comparison of shear strength of soldered SMD resistors for various solder alloys

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F15%3A10314573" target="_blank" >RIV/00216208:11320/15:10314573 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/15:00233975

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2015.7247997" target="_blank" >http://dx.doi.org/10.1109/ISSE.2015.7247997</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2015.7247997" target="_blank" >10.1109/ISSE.2015.7247997</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Comparison of shear strength of soldered SMD resistors for various solder alloys

Popis výsledku v původním jazyce

Mechanical stability of solder joints has influence on total reliability of electronic products. Mechanical stress affect on properties of solder joints during function, transport and storage of the electronic products. A method which is commonly used inelectronic industry to classify the mechanical properties and reliability of solder joints is shear test. This article deals with the comparison of mechanical stability of soldered joints from the point of shear strength of soldered SMD resistors. Threetypes of solder pastes, one lead Sn62Pb36Ag2 and two lead free Sn42Bi58 and Sn96.5Ag3Cu0.5, were used for solder joint preparation. In addition, influence of solder paste amount on shear strength of soldered SMD component, were compared. The type of solder paste and its applied amount together with the temperature profile are interesting parameters from point of economic aspects, especially in case of mass production, where it is possible to achieve considerable savings. The results sho

Název v anglickém jazyce

Comparison of shear strength of soldered SMD resistors for various solder alloys

Popis výsledku anglicky

Mechanical stability of solder joints has influence on total reliability of electronic products. Mechanical stress affect on properties of solder joints during function, transport and storage of the electronic products. A method which is commonly used inelectronic industry to classify the mechanical properties and reliability of solder joints is shear test. This article deals with the comparison of mechanical stability of soldered joints from the point of shear strength of soldered SMD resistors. Threetypes of solder pastes, one lead Sn62Pb36Ag2 and two lead free Sn42Bi58 and Sn96.5Ag3Cu0.5, were used for solder joint preparation. In addition, influence of solder paste amount on shear strength of soldered SMD component, were compared. The type of solder paste and its applied amount together with the temperature profile are interesting parameters from point of economic aspects, especially in case of mass production, where it is possible to achieve considerable savings. The results sho

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/LM2011025" target="_blank" >LM2011025: LMNT - Laboratoře magnetizmu a nízkých teplot - provoz a rozvoj národní výzkumné infrastruktury</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

978-1-4799-8860-0

ISSN

2161-2528

e-ISSN

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Počet stran výsledku

4

Strana od-do

237-240

Název nakladatele

IEEE

Místo vydání

New York, USA

Místo konání akce

Eger, Hungary

Datum konání akce

6. 5. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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