Solder joint quality evaluation based on heating factor

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F18%3A00319146" target="_blank" >RIV/68407700:21230/18:00319146 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/00216305:26220/18:PU129378

Výsledek na webu

<a href="http://www.emeraldinsight.com/doi/abs/10.1108/CW-10-2017-0059" target="_blank" >http://www.emeraldinsight.com/doi/abs/10.1108/CW-10-2017-0059</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/CW-10-2017-0059" target="_blank" >10.1108/CW-10-2017-0059</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Solder joint quality evaluation based on heating factor

Popis výsledku v původním jazyce

Purpose – The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor. Design/methodology/approach – The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints. Findings – The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s . K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease. Originality/value – The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.

Název v anglickém jazyce

Solder joint quality evaluation based on heating factor

Popis výsledku anglicky

Purpose – The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor. Design/methodology/approach – The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints. Findings – The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s . K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease. Originality/value – The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF15_003%2F0000464" target="_blank" >EF15_003/0000464: Centrum pokročilé fotovoltaiky</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Circuit World

ISSN

0305-6120

e-ISSN

1758-602X

Svazek periodika

44

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

8

Strana od-do

37-44

Kód UT WoS článku

000424871900006

EID výsledku v databázi Scopus

2-s2.0-85040040783