Relationship of soldering profile, voids, formation and strength of soldered joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955621" target="_blank" >RIV/49777513:23220/19:43955621 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/8810303" target="_blank" >https://ieeexplore.ieee.org/document/8810303</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2019.8810303" target="_blank" >10.1109/ISSE.2019.8810303</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Relationship of soldering profile, voids, formation and strength of soldered joints

Popis výsledku v původním jazyce

This paper deals with relationship of soldering profile, void formation and mechanical strength of resulted solder joints. An experiment was design for this purpose. For the experiment, four solder paste (BiSnAg, SAC305, Sn100C, SnSb) and three surface finishes of PCB (ENIG, immersion Ag, immersion Sn) were used. Chip resistors 1206 were soldered by different soldering profile. The soldered joints were observed by X-ray and the void areas were calculated. The mechanical strength of the joints was measured after that. From the results, it is possible to find out the influence of surface finishes, soldering profiles or solder alloys on the formation of voids (area) and on the mechanical strength of joints.

Název v anglickém jazyce

Relationship of soldering profile, voids, formation and strength of soldered joints

Popis výsledku anglicky

This paper deals with relationship of soldering profile, void formation and mechanical strength of resulted solder joints. An experiment was design for this purpose. For the experiment, four solder paste (BiSnAg, SAC305, Sn100C, SnSb) and three surface finishes of PCB (ENIG, immersion Ag, immersion Sn) were used. Chip resistors 1206 were soldered by different soldering profile. The soldered joints were observed by X-ray and the void areas were calculated. The mechanical strength of the joints was measured after that. From the results, it is possible to find out the influence of surface finishes, soldering profiles or solder alloys on the formation of voids (area) and on the mechanical strength of joints.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/LO1607" target="_blank" >LO1607: RICE – Nové technologie a koncepce pro inteligentní průmyslové systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/

ISBN

978-1-7281-1874-1

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Wroclaw, Poland

Datum konání akce

15. 5. 2019

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000507501000075