Ultrasonic soldering, mechanical properties of solder joints
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00315617" target="_blank" >RIV/68407700:21230/17:00315617 - isvavai.cz</a>
Výsledek na webu
<a href="http://ieeexplore.ieee.org/document/8000925/" target="_blank" >http://ieeexplore.ieee.org/document/8000925/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2017.8000925" target="_blank" >10.1109/ISSE.2017.8000925</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Ultrasonic soldering, mechanical properties of solder joints
Popis výsledku v původním jazyce
Mechanical properties of solder joints have influence on reliability of electronic products. Therefore the knowledge of the mechanical behavior of solder joints is very important. This article deals with comparison of mechanical properties of solder joints prepared with conventional soldering methods and ultrasonic soldering methods. Material for samples preparation was based on two PCB (material FR4) with soldering pads which were soldered together. As solder alloy was used Sn965Ag3Cu0.5 for convention soldering method and active soldering alloy for ultrasound soldering. The mechanical resistance, changes according to used surface finishes the highest share strength, have been achieved for solder joints which ware prepared by ultrasonic soldering on pads with copper surface finish, worst results were achieved for pads with ENIG and HASL surface finishes.
Název v anglickém jazyce
Ultrasonic soldering, mechanical properties of solder joints
Popis výsledku anglicky
Mechanical properties of solder joints have influence on reliability of electronic products. Therefore the knowledge of the mechanical behavior of solder joints is very important. This article deals with comparison of mechanical properties of solder joints prepared with conventional soldering methods and ultrasonic soldering methods. Material for samples preparation was based on two PCB (material FR4) with soldering pads which were soldered together. As solder alloy was used Sn965Ag3Cu0.5 for convention soldering method and active soldering alloy for ultrasound soldering. The mechanical resistance, changes according to used surface finishes the highest share strength, have been achieved for solder joints which ware prepared by ultrasonic soldering on pads with copper surface finish, worst results were achieved for pads with ENIG and HASL surface finishes.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2017
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
40th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-5386-0582-0
ISSN
2161-2536
e-ISSN
—
Počet stran výsledku
4
Strana od-do
—
Název nakladatele
IEEE
Místo vydání
New York
Místo konání akce
Sofia
Datum konání akce
10. 5. 2017
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
000426973000048