Comparison of mechanical resistance of SnCu and SnBi of solder joints
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00315797" target="_blank" >RIV/68407700:21230/17:00315797 - isvavai.cz</a>
Výsledek na webu
<a href="http://ieeexplore.ieee.org/document/8000924/" target="_blank" >http://ieeexplore.ieee.org/document/8000924/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2017.8000924" target="_blank" >10.1109/ISSE.2017.8000924</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Comparison of mechanical resistance of SnCu and SnBi of solder joints
Popis výsledku v původním jazyce
Mechanical stress act on solder joints during transport, function and storage of the electronic equipment. Therefore, the knowledge of solder joints resistance against it is very useful. This article deals with comparison of mechanical resistance of SnCu0,7 and Sn42Bi58 solder alloys. The experiments were based on two PCBs (smaller and larger one, with soldering pads designed according to commonly used chip package) which were soldered together. Surface finishes of soldering pads were OSP, ENIG and HASL. Mechanical test were based on sharp tip, which were driving between two PCBs. From overall point of view a slightly better results were achieved for Sn42Bi58 solder alloy. Additionally the thicknesses of intermetallic layers were compared and voids frequency inside solder joints were inspected.
Název v anglickém jazyce
Comparison of mechanical resistance of SnCu and SnBi of solder joints
Popis výsledku anglicky
Mechanical stress act on solder joints during transport, function and storage of the electronic equipment. Therefore, the knowledge of solder joints resistance against it is very useful. This article deals with comparison of mechanical resistance of SnCu0,7 and Sn42Bi58 solder alloys. The experiments were based on two PCBs (smaller and larger one, with soldering pads designed according to commonly used chip package) which were soldered together. Surface finishes of soldering pads were OSP, ENIG and HASL. Mechanical test were based on sharp tip, which were driving between two PCBs. From overall point of view a slightly better results were achieved for Sn42Bi58 solder alloy. Additionally the thicknesses of intermetallic layers were compared and voids frequency inside solder joints were inspected.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2017
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
40th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-5386-0582-0
ISSN
2161-2536
e-ISSN
—
Počet stran výsledku
4
Strana od-do
—
Název nakladatele
IEEE
Místo vydání
New York
Místo konání akce
Sofia
Datum konání akce
10. 5. 2017
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
000426973000047