Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00351163" target="_blank" >RIV/68407700:21230/21:00351163 - isvavai.cz</a>
Výsledek na webu
<a href="https://ieeexplore.ieee.org/document/9467552" target="_blank" >https://ieeexplore.ieee.org/document/9467552</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467552" target="_blank" >10.1109/ISSE51996.2021.9467552</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish
Popis výsledku v původním jazyce
Abstract: The study attends to the evaluation of solder joints from a mechanical point of view. Two lead-free alloys Sn99.7Cu0.3 and Sn96.5Ag3Cu0.5 (SAC305) were selected for samples preparation. To compare the results of current alloys with the most utilized solder in the past, the study comprises eutectic lead solder paste Sn63Pb37, too. Solder joints intended for observation were created by assembling chip resistors. Assembled boards were reflowed employing a hot air convection oven. Mechanical properties were evaluated by performing shear tests and microhardness measurements. Microhardness of bulk solder and intermetallic compounds (IMC) was measured using the micro-indentation Vickers test. For this purpose, a metallographic cross-section of some samples was accomplished. Solder pads on testing boards were coated by Organic Solder Preservative (OSP) and Hot Air Solder Levelling (HASL). Depending on solder paste type, the results show more or less impact of surface finish on the solder hardness. Some difference in microhardness of IMC layers and shear strength was also detected but, in these tests, results are not in favour of one surface treatment.
Název v anglickém jazyce
Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish
Popis výsledku anglicky
Abstract: The study attends to the evaluation of solder joints from a mechanical point of view. Two lead-free alloys Sn99.7Cu0.3 and Sn96.5Ag3Cu0.5 (SAC305) were selected for samples preparation. To compare the results of current alloys with the most utilized solder in the past, the study comprises eutectic lead solder paste Sn63Pb37, too. Solder joints intended for observation were created by assembling chip resistors. Assembled boards were reflowed employing a hot air convection oven. Mechanical properties were evaluated by performing shear tests and microhardness measurements. Microhardness of bulk solder and intermetallic compounds (IMC) was measured using the micro-indentation Vickers test. For this purpose, a metallographic cross-section of some samples was accomplished. Solder pads on testing boards were coated by Organic Solder Preservative (OSP) and Hot Air Solder Levelling (HASL). Depending on solder paste type, the results show more or less impact of surface finish on the solder hardness. Some difference in microhardness of IMC layers and shear strength was also detected but, in these tests, results are not in favour of one surface treatment.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2021
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
2021 44th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-1477-7
ISSN
—
e-ISSN
2161-2528
Počet stran výsledku
6
Strana od-do
1-6
Název nakladatele
IEEE Press
Místo vydání
New York
Místo konání akce
Bautzen
Datum konání akce
5. 5. 2021
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
—