Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00341238" target="_blank" >RIV/68407700:21230/20:00341238 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE49702.2020.9120951" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9120951</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120951" target="_blank" >10.1109/ISSE49702.2020.9120951</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties

Popis výsledku v původním jazyce

Voids inside solder joints are empty spaces which can cause reliability issues. Solder joints with voids are weaker from a mechanical point of view. Additionally, the soled joints with voids are worse from the point of thermal and electrical properties. This article deals with voids inside solder joint prepared with Sn96,5Ag3Cu0,5 solder paste with different properties from the point of flux type and size of solder alloy powder. The aim of this work is to evaluate the influence of flux and particles size on the voids formation. Preparation of solder joints was done at the same process conditions for all samples. Solder joints were analysed via X-ray with following image analyses of voids. The results show that the less aggressive flux caused slightly higher voids formation from the point of the average surface area of voids at the soldering pad. Additionally, the results show that the slightly higher voids formation appears in case of solder paste with smaller solder alloy particles.

Název v anglickém jazyce

Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties

Popis výsledku anglicky

Voids inside solder joints are empty spaces which can cause reliability issues. Solder joints with voids are weaker from a mechanical point of view. Additionally, the soled joints with voids are worse from the point of thermal and electrical properties. This article deals with voids inside solder joint prepared with Sn96,5Ag3Cu0,5 solder paste with different properties from the point of flux type and size of solder alloy powder. The aim of this work is to evaluate the influence of flux and particles size on the voids formation. Preparation of solder joints was done at the same process conditions for all samples. Solder joints were analysed via X-ray with following image analyses of voids. The results show that the less aggressive flux caused slightly higher voids formation from the point of the average surface area of voids at the soldering pad. Additionally, the results show that the slightly higher voids formation appears in case of solder paste with smaller solder alloy particles.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-7281-6773-2

ISSN

2161-2536

e-ISSN

2161-2528

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Demanovska Valley

Datum konání akce

14. 5. 2020

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000610543500022