The Analysis of Wire Bonding Reliability under Critical Operating Conditions

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F20%3APU137009" target="_blank" >RIV/00216305:26220/20:PU137009 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9120937" target="_blank" >https://ieeexplore.ieee.org/document/9120937</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120937" target="_blank" >10.1109/ISSE49702.2020.9120937</a>

Jazyk výsledku

angličtina

Název v původním jazyce

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

Popis výsledku v původním jazyce

This study deals with properties of the wire bond connection under critical operating conditions. Changes in electrical resistivity and mechanical strength of the connection were analyzed. In this case, critical conditions are high ambient temperature and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μm and 25,4 μm thick golden wire that was welded on thick golden film layer. However, a significant change was found in mechanical strength. The idea of an experiment is based on an assumption that this effect depends on the structure of the bonding pad and structural change of the golden wire.

Název v anglickém jazyce

The Analysis of Wire Bonding Reliability under Critical Operating Conditions

Popis výsledku anglicky

This study deals with properties of the wire bond connection under critical operating conditions. Changes in electrical resistivity and mechanical strength of the connection were analyzed. In this case, critical conditions are high ambient temperature and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μm and 25,4 μm thick golden wire that was welded on thick golden film layer. However, a significant change was found in mechanical strength. The idea of an experiment is based on an assumption that this effect depends on the structure of the bonding pad and structural change of the golden wire.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

43nd International Spring Seminar on Electronics Technology (ISSE).

ISBN

978-1-7281-6773-2

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

4

Strana od-do

1-4

Název nakladatele

IEEE

Místo vydání

Neuveden

Místo konání akce

Demänovská dolina

Datum konání akce

14. 5. 2020

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—