Wire-Bonds Durability in High-Temperature Applications
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F13%3APU107185" target="_blank" >RIV/00216305:26220/13:PU107185 - isvavai.cz</a>
Výsledek na webu
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DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Wire-Bonds Durability in High-Temperature Applications
Popis výsledku v původním jazyce
This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, which have high operating temperature. Especially, Heraeus HeraLock 2000 substrate is investigated. The paper is mainly focused on the behaviour and reliability of wire-bonds, which are used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity were studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software. Created mathematical model simulated and compared differences between gold and aluminium wire-bond.
Název v anglickém jazyce
Wire-Bonds Durability in High-Temperature Applications
Popis výsledku anglicky
This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, which have high operating temperature. Especially, Heraeus HeraLock 2000 substrate is investigated. The paper is mainly focused on the behaviour and reliability of wire-bonds, which are used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity were studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software. Created mathematical model simulated and compared differences between gold and aluminium wire-bond.
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
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Návaznosti výsledku
Projekt
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Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2013
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
ElectroScope - http://www.electroscope.zcu.cz
ISSN
1802-4564
e-ISSN
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Svazek periodika
2013
Číslo periodika v rámci svazku
5
Stát vydavatele periodika
CZ - Česká republika
Počet stran výsledku
5
Strana od-do
7-11
Kód UT WoS článku
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EID výsledku v databázi Scopus
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