Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU140710" target="_blank" >RIV/00216305:26220/21:PU140710 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.mdpi.com/1996-1944/14/9/2218/htm" target="_blank" >https://www.mdpi.com/1996-1944/14/9/2218/htm</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma14092218" target="_blank" >10.3390/ma14092218</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

Popis výsledku v původním jazyce

The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.

Název v anglickém jazyce

Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

Popis výsledku anglicky

The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20501 - Materials engineering

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Materials

ISSN

1996-1944

e-ISSN

—

Svazek periodika

14

Číslo periodika v rámci svazku

9

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

12

Strana od-do

1-12

Kód UT WoS článku

000650552100001

EID výsledku v databázi Scopus

2-s2.0-85105608265