Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43963517" target="_blank" >RIV/49777513:23220/21:43963517 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.mdpi.com/1996-1944/14/22/7039" target="_blank" >https://www.mdpi.com/1996-1944/14/22/7039</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma14227039" target="_blank" >10.3390/ma14227039</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications

Popis výsledku v původním jazyce

This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 W/square and low temperature coefficient of resistance 10010????6 K????1 values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.

Název v anglickém jazyce

Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications

Popis výsledku anglicky

This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 W/square and low temperature coefficient of resistance 10010????6 K????1 values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Materials

ISSN

1996-1944

e-ISSN

—

Svazek periodika

14

Číslo periodika v rámci svazku

22

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

7

Strana od-do

1-7

Kód UT WoS článku

000724889300001

EID výsledku v databázi Scopus

2-s2.0-85119903968